Fujitsu Corporation

Tominaga Watanabe

Hideo Sugawara

Setsuya Nagaya

Shin Watanabe

Hideki Ikuta

A high-performance low-cost functional module package handles microwaves or millimeter waves. The package has multilayered dielectric substrates, signal through holes (25, 28) connected to signal conductors that are formed on one of the dielectric substrates, and ground through holes (24, 26, 27, 29) connected to ground conductors that are formed on another of the dielectric substrates. The through holes are formed on side faces of the dielectric substrates and serve as terminals. Each pair of the ground through holes (24 and 26, or 27 and 29) is arranged on opposite sides of a corresponding one (25 or 28) of the signal through holes. The terminals are positioned between parts of the package to be connected to an external circuit board and the signal and ground conductors.

Microwave/millimeter-wave functional module package

An amplifying circuit is suitable for an integrated circuit that has a characteristic of low-noise, high-gain, and low-consumptive current. In the circuit, transistors or FETs are used as amplifying elements. A basic amplifying circuit employing transistors, that forms a differential pair of first and second transistors, first and second resistors connected to each collector of the first and second transistors, and a constant current source connected to a common emitter of the first and second transistors, comprises a third transistor, of which emitter is connected to a connecting point of the first and second resistors, a condenser connected between a connecting point of the first transistor and the first resistor, or a connecting point of the second transistor and the second resistor, and a base of the third transistor, and a voltage source connected to a collector of the third transistor, wherein outputs are obtained from an emitter of the third transistor.

Growing community of inventors

Kawasaki, Japan

Tominaga Watanabe