Qualcomm Incorporated

Rf360 Singapore Pte. Ltd.

Epcos Ag

Snaptrack Incorporated

Tomasz Jewula

Werner Ruile

Ulrich Knauer

Matthias Honal

Charles Binninger

Helmut Zottl

Rudolf Nuessl

Maximilian Schiek

Bernhard Bader

Christian Ceranski

Veit Meister

Siew Ling Koh

Siew Li Poh

Pei Wen Qiao

Certain aspects of the present disclosure provide a surface acoustic wave (SAW) device with one or more intermediate layers for reduced self-heating and methods for fabricating such a SAW device. One example SAW device generally includes a piezoelectric layer and an interdigital transducer (IDT) disposed above the piezoelectric layer. The IDT generally includes a first electrode having a first busbar and a first plurality of fingers. The first electrode generally includes a first copper layer disposed above the piezoelectric layer, a first intermediate layer disposed above the first copper layer, the first intermediate layer comprising a different material than the first copper layer, and a second copper layer disposed above the first intermediate layer.

Surface acoustic wave (SAW) device with one or more intermediate layers for self-heating improvement

An electro-acoustic resonator comprises a piezoelectric substrate on which an electrode structure is disposed. The electrode structure comprises a metal layer of aluminum and copper, a barrier layer forming a barrier against the diffusion of copper and another metal layer disposed on the barrier layer comprising aluminum. An AlCu intermetallic phase formed after an anneal is restricted to the portion beneath the barrier layer so that Galvano-corrosion of the electrode structure is avoided.

Electro-acoustic resonator and method of forming thereof

In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient &#x3b1;, which is substantially higher than the first thermal conductivity coefficient &#x3b1;of the substrate. The heat dissipation then succeeds via the heat-conducting means and via connecting means which connect the substrate to a carrier.

Component with improved heat dissipation

In order to improve heat dissipation from electrical components with heat-generating component structures, it is proposed to provide a radiation layer with a large surface in the area of the component structures. Preferably, the radiation layer is very heat-conductive or in heat-conductive connection with the component structures.

Electrical component with heat dissipation

A metallization, for carrying current in an electrical component, includes a bottom layer overlying a substrate surface and includes titanium (Ti) or a titanium compound as main constituent. An upper layer overlies the bottom layer and includes copper (Cu) as main constituent. The bottom layer and the upper layer form a base layer. A top layer is in direct contact with the upper layer and includes aluminum (Al) as main constituent. The base layer further includes a middle layer, consisting of silver, that is arranged between the bottom layer and the upper layer.

Metallization having high power compatibility and high electrical conductivity

A metallization can be used for components working with acoustic waves. The metallization includes a base having a bottom layer comprising titanium, and an upper layer comprising copper. A top layer of the metallization disposed on the base comprises aluminum.

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Markt Schwaben, Germany

Tomasz Jewula