Mitsubishi Electric Corporation

Toma Takao

Toshiya Tadakuma

A semiconductor device includes a semiconductor module, a substrate, and a filler. The semiconductor module includes a semiconductor chip, a control integrated circuit (IC) configured to control driving of the semiconductor chip, and a package sealing the semiconductor chip and the control IC with an insulation material. On the substrate, the semiconductor module is mounted. The filler is provided between a lower surface of the package of the semiconductor module and the substrate. The substrate includes a through hole being provided at a position below the package and closer to the control IC than to the semiconductor chip in the package.

Semiconductor device and method of manufacturing semiconductor device

A semiconductor device includes a plurality of semiconductor elements including a power semiconductor element, a lead frame including one main surface on which the plurality of semiconductor elements are mounted, a resin that seals the plurality of semiconductor elements and a part of the lead frame where the plurality of semiconductor elements are mounted, and at least one shield member disposed above the plurality of semiconductor elements on a side of the one main surface of the lead frame. The shield member is held by the resin, and the shield member has a higher magnetic permeability or a higher electrical conductivity than the resin.

Growing community of inventors

Tokyo, Japan

Toma Takao