Alpine Microsystems, Inc.

Tom L Todd

Andrew K Wiggin

Sammy K Brown

George E Avery

Sam Beal

Martin P Goetz

A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system while reducing contact degradation due to stress that results from differences in the coefficients of thermal expansion of the various components during thermal cycling

Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact

A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system while reducing contact degradation due to stress that results from differences in the coefficients of thermal expansion of the various components during thermal cycling.

System and method for packaging integrated circuits

A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system. In one embodiment of the system of the present invention, a plurality of carriers corresponds to a plurality of ICs, and a board has a plurality of board regions for receiving the plurality of ICs and are arranged so as to be attached to a backplane forming a vertical stack of boards.

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San Jose, CA, United States of America

Tom L Todd