Texas Instruments Corporation

Tom L Fowler

David G Daniels

James H Howser

Aiman Alhoussami

A current limit circuit regulates the current flow through a power switchby measuring the current through the switchand comparing it to a reference voltage Vthat represents the limit current. When the current through the power switchis greater than the limit current, the current in the power switchis pulled lower by a driver circuitwhich controls the power switch. By using a current limit reference voltage that has two levels, the power switchhas two current limit thresholds. Using a comparatorto compare the input voltage of the power switchto the output voltage of the power switch, an output signal is generated to control the current limit threshold. When the input voltage and output voltage has a large differential voltage, a lower current limit threshold voltage is selected. When the input voltage and output voltage has a small differential voltage, an upper limit threshold voltage is selected.

Inrush current control method using a dual current limit power switch

An apparatus for generating a supply voltage includes a first regulator for generating a first supply voltage, a second regulator for generating a second supply voltage, and a feedback circuit to control the second regulator.

Method for simultaneous output ramp up of multiple regulators

A multi-component electronic assembly (,) including a leadframe (,) having upper and lower surfaces and a plurality of conductive leads (,). Each lead (,) has first bonding surfaces (,) on the upper surface of each lead and second bonding surfaces (,) on the lower surface of each lead (,). Preferably, each lead has a plurality of third bonding surfaces (,) formed on at least some of the plurality of leads where the third bonding surfaces (,) are formed by conductive extensions of the leads (,) that extend towards the center of the assembly (,). A first passive component (,) is electrically and mechanically coupled to the first bonding surfaces. A second passive component (,) is electrically and mechanically coupled to the second bonding surfaces. Where third bonding surfaces (,) are used, a third component (,) is electrically and mechanically coupled to the third bonding surfaces (,).

Integrated circuit with tightly coupled passive components

A multi-component electronic assembly (100) including a leadframe (101) having upper and lower surfaces and a plurality of conductive leads (203). Each lead (203) has first bonding surfaces (201) on the upper surface of each lead and second bonding surfaces (201) on the lower surface of each lead (203). Preferably, each lead has a plurality of third bonding surfaces (202) formed on at least some of the plurality of leads where the third bonding surfaces (202) are formed by conductive extensions of the leads (203) that extend towards the center of the assembly (100). A first passive component (102) is electrically and mechanically coupled to the first bonding surfaces. A second passive component (104) is electrically and mechanically coupled to the second bonding surfaces. Where third bonding surfaces (202) are used, a third component (103) is electrically and mechanically coupled to the third bonding surfaces (202).

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Garland, TX, United States of America

Tom L Fowler