Microelectronics and Computer Technology Corporation

Advanced Micro Devices Corporation

Tom J Hirsch

Charles W Lin

Chung J Lee

Colin A MacKay

Heinrich G Muller

Ian Y Yee

Robert F Miracky

Kimcuc T Tran

Benjamin Beker

A computer power supply system for reducing the AC impedance of a DC power supply () at inputs pins of a computing device () such as a processor. A quarter wavelength transmission line stub () is connected to a computing device DC power supply input pin. The stub is open circuited at its end opposite the pin. The wavelength is selected to match a frequency at which power supply impedance is known to be high. The stub appears as a low impedance at the selected frequency. Multiple stubs at different frequencies may be used to provide reduced impedance over a broader frequency band. Stubs may be formed from printed circuit board traces on a motherboard of from metalization patterns on a computing device package.

Stub transformer for power supply impedance reduction

The invention provides an apparatus and methods of using the apparatus to transfer conductive patterns onto substrates under conditions of heat and pressure. The apparatus comprises a master mold with a printing surface on which is produced a permanent mirror image of the conductive pattern to be created. This pattern is then coated with a loosely adherent film of conductive metal, such as copper, which is transferred onto a substrate to be printed.

Method for producing conductive patterns

A dielectric substrate is coated with a protective layer and a catalyst film is formed in a laser irradiated predetermined pattern on the protective layer so that during electroless deposition a metal is plated on the catalyst film in the predetermined pattern whether or not the dielectric has unwanted catalytic sites. The protective layer is not removed by the electroless plating bath or prior etch steps but can subsequently be stripped by a separate etch without removing the plated metal or the dielectric from the substrate.

Protective layer for preventing electroless deposition on a dielectric

Solder reflow on an electrical interconnect substrate between a plurality of electrical contacts. The method includes coating the contacts with tin/lead solder, depositing a wetting metal between the contacts, and heating the substrate to at least the melting point of the solder so that the solder melts, reflows across the wetting metal and connects or links the contacts. The entire surface of a customizable copper/polyimide substrate can be personalized by solder links and TAB leads from surface-mounted integrated circuits can simultaneously be soldered to the substrate.

Method of patterned metal reflow on interconnect substrates

A method for patterning electroless plated metal on a polymer substrate. In a first embodiment a substrate is first coated with a polymer suitable for complexing a seed metal which can initiate electroless plating. The polymer is then mixed with a seed metal such as palladium, selectively irradiated to form the desired conductor pattern, and then etched so that the desired pattern remains. The substrate is subsequently placed in an electroless plating bath to form a metal pattern. In a second embodiment, before applying the seed metal a substrate immersed in a polymer solution suitable for complexing a seed metal can be selectively irradiated to selectively deposit polymer on the substrate, followed by applying a seed metal to form a polymer-seed metal mixture and an electroless plating bath. In addition, an alkaline chemical may be added to an acidic polymer to prevent the polymer from etching metal on the substrate.

Method for patterning electroless plated metal on a polymer substrate

A method is described for patterning electroless plated metal on a polymer substrate. A substrate is first coated with a polymer suitable for complexing noble metal compounds. The substrate is then complexed with a noble metal compound, such as containing palladium, selectively irradiated to form the desired conductor pattern, and then etched so that the desired pattern remains. The substrate is subsequently placed in an electroless plating bath to form a metal pattern. Alternatively, before applying the noble metal compound, a substrate immersed in a polymer solution suitable for complexing a noble metal compound can be selectively irradiated to selectively deposit polymer on the substrate, followed by applying a noble metal compound and an electroless plating bath.

Growing community of inventors

Austin, TX, United States of America

Tom J Hirsch