Honeywell International Inc.

Tom Hensley

Eric Irving

Charles P Pinney

In a system for housing electronics cards, methods and systems for cooling the electronics cards are presented. Each electronics card preferably contains heat-producing electronics and a heat sink, and is preferably placed within a card guide of the chassis and secured into position with a clamping device. At least one of the heat sink, the card guide, the clamping device, and a cold wall of the chassis are used to facilitate the conduction cooling of the heat-producing electronics. Furthermore, a clamping device may rigidly secure a card into position, thus reducing the impact of vibrations (including shock) on the card. Additionally, an air flow further cools the electronics cards, the card guides, and/or the cold wall.

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Albuquerque, NM, United States of America

Tom Hensley