Motorola Corporation

Tom Gall

Don Zito

Declan E Killarney

William R Rochowicz

Chris Van Houten

An electronic module ( ) includes a first circuit substrate ( ) and a second circuit substrate ( ). The first circuit substrate ( ) has a post surface ( ) and a post ( ) protruding from the post surface ( ). The second circuit substrate ( ) has an upper surface ( ) opposed to a lower surface ( ). The second circuit substrate ( ) forms an opening ( ). The first circuit substrate ( ) may be manufactured using a Molded Interconnect Device substrate. The second circuit substrate ( ) may be manufactured using a High Density Interconnect substrate. The second circuit substrate ( ) is placed on top of the first circuit substrate ( ) so that the post ( ) of the first circuit substrate ( ) is mated with the opening ( ) of the second circuit substrate ( ). During a solder screening process a solder paste is applied to the opening ( ) of the second circuit substrate ( ), and during a solder reflow operation the solder paste melts and a connection is formed between the first circuit substrate ( ) and the second circuit substrate ( ).

Growing community of inventors

Northbrook, IL, United States of America

Tom Gall