Intel Corporation

Intel-Ge Care Innovations LLC

Tom E Pearson

Christopher D Combs

Raiyomand F Aspandiar

Arjang Fartash

George L Arrigotti

Damion T Searls

Terrance J Dishongh

Peter Chang

James Daniel Jackson

Terry Dishongh

Carolyn R McCormick

Jayne L Mershon

Jia-Hung Tseng

Gerrit John Vreman

Terrance J O'Shea

Richard D Roberts

David Shia

George Hsieh

Weston C Roth

Dudi I Amir

David I Amir

Ralyomand F Aspandiar

An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (IPSFN) package may be affixed to a cover glass surface along a perimeter of a display. IPSFN packages may incorporate a photo-emitter chip and a photo-detector chip that may be inclined for a desired angle of incidence relative to the cover glass. A CMOS integrated optical transceiver package may include inclined photonic chips and a non-inclined CMOS chip having at least one of a photo-emitter driver, or a photo-detector TIA and/or ADC. A chip package lead frame may include cantilevered paddle tabs amenable to controlled deflection during package assembly. An inclined packaging assembly method may include attaching a chip to a lead frame paddle and form pressing the lead frame to incline the chip to a desired angle before encapsulation.

Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies

Embodiments of the disclosure describe data transmission via a touchscreen display of a mobile computing device. The mobile computing device includes a peripheral component, integrated into a touchscreen display surface housing, and a plurality of photonic pulse transmitters and receivers disposed on edges of the touchscreen display surface. One or more receivers receive pulses from the photonic pulse transmitters for detecting user touch inputs on the touchscreen display surface. A photonic pulse modulator modulates a pulse to be transmitted from one of the photonic pulse transmitters based, at least in part, on peripheral component data. A photonic pulse demodulator demodulates the modulated pulse received by the pulse detector(s) to retrieve the peripheral component data. By utilizing these pulse transmitters/receivers, used for user touch input detection, to also exchange data via modulated light, the bezel area around the touchscreen display surface may be reduced.

Wireless peripheral data transmission for touchscreen displays

Methods and systems may include a motion sensor and logic to sample an output signal of the motion sensor. The logic can also be configured to track an amount of time the motion sensor is triggered based on the output signal, and transmit the amount of time over a wireless link on a periodic basis.

Temporal based motion sensor reporting

A method and apparatus are provided for determining whether solder used during assembly of a printed circuit board is lead-free or not. This may include providing a pad on the printed circuit board and placing solder on the pad in a predetermined pattern. The solder may be heated so as to create reflow. The solder may later be examined to determine if the solder is lead-free.

Method and structure for identifying lead-free solder

A side-mounted capacitor for a semiconductor die package is described. In one embodiment, a substrate has a die side to which an IC (integrated circuit) may be attached, and an edge adjacent the die side. A bypass capacitor is attached to the package substrate edge.

Capacitor placement for integrated circuit packages

Solder connections are created between the substrate of an electronic package and a circuit board having lengths that are longer than the width. The solder connections are created by locating solder balls of power or ground connections close enough to one another so that, upon reflow to the circuit board the solder balls combine, creating a larger solder connection. Signal solder balls, however, remain separated. The power or ground solder balls on a particular bond pad are separated from one another by portions of a removable solder mask that keep the solder balls spherical in shape during solder ball attachment to the electronic package. However, it is removed prior to reflow to the circuit board, thus creating a larger, longer solder connection between the electronic package and circuit board.

Method of creating solder bar connections on electronic packages

An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hole of the printed circuit board and include a compressible section to compress when inserted into the first hole and to expand after passing through the first hole. The compressible section of the first leg may support solder between the anchoring mechanism and the first hole. Likewise, the second leg may mount through a second hole of the printed circuit board and include a compressible section to compress when inserted into the second hole and to expand after passing through the second hole. The compressible section of the second leg may support solder between the anchoring mechanism and the second hole.

Soldered heat sink anchor and method of use

Embodiments of stiffening members in accordance with the present invention provide a mechanical support that is wave soldered to the frontside of the system substrate simultaneously with other wave soldered components. The stiffening member comprises a flat plate with a plurality of mounting pins. The number of mounting pins are predetermined to provide the plate with sufficient support to resist expected loading conditions when wave soldered in plated through holes on a system substrate. The mounting pins are adapted for insertion into plated through holes on the system substrate. The length of the mounting pins are predetermined to account for the height of the SMT component upon which it is attached, the thickness of the system substrate, and the desired amount of mounting pin protrusion from the backside of the system substrate. The stiffening members consume very little system substrate space while retaining a platform for heat dissipation.

Structural reinforcement for electronic substrate

An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-shrinkable member and a retaining member. Being formed from a heat-shrinkable material, the heat-shrinkable member is configured to receive a post extending through an opening formed in a double-sided printed circuit board from a component previously assembled on one side thereof. The retaining member is coupled with the heat-shrinkable member, and the double-sided printed circuit board is disposed substantially between the retaining member and the component. The heat-shrinkable member is configured to shrinkably engage the post when an opposite side of the double-sided printed circuit board is populated and reflowed, retaining the inverted component on the double-sided printed circuit board.

Heat-shrinkable retainer for PCB double-sided assembly

Apparatus and methods of fabricating antennae embedded within a ceramic material, such as a low temperature co-fired ceramic. Such ceramic material has a low coefficient of thermal expansion which reduces expansion and contraction stresses that can cause the signal transmission frequency to change and thereby affecting proper signal transmission.

Ceramic embedded wireless antenna

According to a method of mounting electronic components on a printed circuit board (PCB), the electrical contacts of the components are coupled to PCB bonding pads that are intersected by via pads. To minimize various defects encountered during solder reflow, while concurrently minimizing PCB area and manufacturing costs, the via pads are formed so that the via holes substantially avoid underlying the solder fillets coupling the component contacts to the PCB bonding pads. In one embodiment, the via pads are formed in the inter-pad space beneath the component; in another embodiment they are offset from the bonding pads. A substrate, an electronic assembly, and an electronic system are also described.

Methods of manufacturing via intersect pad for electronic components

A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.

Extension mechanism and method for assembling overhanging components

Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprises a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.

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Beaverton, OR, United States of America

Tom E Pearson