Huawei Technologies Co., Limited

Caliopa N.v.

Huawei Technologies Research & Development Belgium Nv

Tom Collins

Marco Lamponi

Sebastien Lardenois

Martijn Tassaert

Martin Tassaert

Joost Brouckaert

A photonic integrated circuit comprises a substrate and a passive layer, which is formed on the substrate and incorporates a passive photonic device. The circuit also comprises a layer of III-V material. The layer of III-V material is arranged in a recess of the passive layer and incorporates an active photonic device. The layer of III-V material is configured such that light can be transferred between the passive photonic device and the active photonic device. This photonic integrated circuit provides the advantages of an active device formed from III-V material in an arrangement that is easily planarized, which enables close integration between the active device and electronic components.

Photonic integrated circuit

A waveguide structure for optical coupling is provided. The waveguide structure includes a first waveguide embedded in a cladding of a lower refractive index than the first waveguide, a second waveguide of a higher refractive index than the cladding, and an intermediate waveguide. The first waveguide and the second waveguide are physically arranged at the same side of the intermediate waveguide to establish an optical coupling between the first waveguide and the second waveguide through the intermediate waveguide. The first waveguide material has a refractive index value smaller than or equal to 3.

Optical coupling scheme

An optical coupling arrangement is provided, comprising a lightwave circuit (LC), a coupling element and an optical waveguide element, wherein the lightwave circuit has a first surface area and wherein the coupling element is attached to the first surface area) such that an optical signal can be transmitted from the lightwave circuit to the coupling element. The optical waveguide element is attached to the coupling element at a first junction zone such that the optical signal can be transmitted from the coupling element to the optical waveguide element). The coupling element is configured to perform mode transformation to the optical signal transmitted from the lightwave circuit to the optical waveguide element and such that adiabatic coupling of the optical signal to the optical waveguide element is enabled. Thus, a better coupling efficiency can be achieved.

Optical coupling arrangement

A process for manufacturing a photonic circuit comprises: manufacturing on a first wafer a first layer stack comprising an underclad oxide layer and a high refractive index waveguide layer; patterning the high refractive index waveguide layer to generate a passive photonic structures; planarizing the first layer stack with a planarizing oxide layer having a thickness below 300 nanometers above the high refractive index waveguide layer; annealing the patterned high refractive index waveguide layer before and/or after the planarizing oxide layer; manufacturing on a second wafer a second layer stack comprising a detachable mono-crystalline silicon waveguide layer; transferring and bonding the first layer stack and the second layer stack; manufacturing active photonic devices in the mono-crystalline silicon waveguide layer; and realizing evanescent coupling between the mono-crystalline silicon waveguide layer and the high refractive index waveguide layer.

Process for manufacturing a photonic circuit with active and passive structures

The present invention provides a waveguide structure for optical coupling. The waveguide structure includes a first waveguide embedded in a cladding of lower refractive index than the first waveguide, and a second waveguide of higher refractive index than the cladding and distanced from the first waveguide. The waveguide structure further includes an intermediate waveguide, of which at least a part is arranged between the first waveguide and the second waveguide. The first waveguide and the second waveguide each comprise a tapered end for coupling light into and/or out of the intermediate waveguide.

A method for producing an integrated optical circuit comprising an active device and a passive waveguide circuit includes: applying an active waveguide structure on a source wafer substrate; exposing a portion of the source wafer substrate by selectively removing the active waveguide structure; applying a passive waveguide structure on the exposed portion of the source wafer substrate, wherein an aggregation of the active waveguide structure and the passive waveguide structure forms the active device, the active device having a bottom surface facing the source wafer substrate; removing the source wafer substrate from the active device; and attaching the active device to a target substrate comprising the passive waveguide circuit such that the bottom surface of the active device faces the target substrate.

Method for producing an integrated optical circuit

An optical interposer comprising an array of first order diffraction grating couplers arranged to couple light emitted by an array of single mode Vertical-Cavity Surface-Emitting Lasers (VCSELs) into optical waveguides, the light being emitted in a direction substantially perpendicular to the optical waveguides; a device for refracting the light over at least 4 degrees; an array of output ports arranged to optically couple light from the optical waveguides into an array of optical fibers or other optical elements; and the optical waveguides connecting the array of first order diffraction grating couplers and the array of output ports to route the light from the diffraction gratings into the output ports.

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Munich, Germany

Tom Collins