Intel Corporation

Tom Birk

Chris Schroeder

John Langmack

Martin M Maxwell

Dave Clay

Thomas A Kvanvig

A device is loaded in a test chamber. The device is positioned for support on a chuck in a non-test position in the test chamber. The device is tested in the test chamber. The chuck is positioned in a test position in the test chamber to place the device in electrical contact with a test apparatus. Coolant is delivered to a heat sink supported by the chuck near the device prior to testing the device and while testing the device. Coolant is delivered to the heat sink through flexible tubing coupled to the chuck as the chuck moves from the non-test position to the test position.

Direct to chuck coolant delivery for integrated circuit testing

A handler throw measuring unit (HTMU) for calibrating a test handler that handles an integrated circuit package. The throw measuring unit includes a plurality of pogo pins that are coupled to a base plate and a spring plate. The pogo pins are deflected when a test handler pushes the spring plate. The HTMU has a gauge that is coupled to the spring plate to measure the amount of pogo pin deflection. The amount of deflection can be provided on a numerical readout. An operator can incrementally move the test handler until the readout provides a desired value.

PLGA test handler throw measuring unit

HTMU test handler throw measuring unit

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Chandler, AZ, United States of America

Tom Birk