Micro Control Company

Tom Alan Tremmel

Harold E Hamilton

Brian R Bloch

John T McElreath

A semiconductor burn-in oven includes a housing including a burn-in chamber and an opening to the burn-in chamber surrounded by a front face, a heating device, testing circuitry, a door and a sealing mechanism. The door has an open position, in which the burn-in chamber is accessible through the opening, and a closed position, in which the door covers the opening. The sealing mechanism is configured to form a seal around the opening between an interior side of the door and the front face when the door is in the closed position. The sealing mechanism includes at least one sealing member having a recessed position, in which a gap extends between the front face and the interior side of the door, and a sealing position, in which the at least one sealing member closes the gap and forms the seal.

Semiconductor burn-in oven chamber sealing

A heat exchange system that can accommodate a high power integrated circuit chip for burn-in temperature stressing includes a heat sink having a chip engaging surface that is adapted to engage a surface of the chip. A liquid layer fills a heat exchange gap between the surface of the chip and the chip engaging surface of the heat sink. The liquid layer provides a low thermal resistance juncture between the chip engaging surface of the heat sink and the surface of the chip, which allows for greater heat transfer therebetween.

Burn-in oven heat exchanger having improved thermal conduction

A heat sink is used for thermally controlling a chip on a burn-in board which is being tested in a burn-in oven. The heat sink includes a resiliently mounted block that will engage a chip under resilient pressure and which is housed in a separate cup that permits accommodating misalignments or shifting of the heat sink when it contacts the chip. Additionally, the block carries a temperature sensor that is resiliently loaded against a chip which the heat sink engages. A bore mounts the temperature sensor and is also connected to a source of helium to provide a layer of helium between a surface of the heat sink and the adjacent surface of the chip for modifying the thermal coupling between the heat sink and the chip.

Temperature controlled high power burn-in board heat sinks

An automatic loading and unloading support for use on the interior of a burn-in oven includes a frame that supports a rack of printed circuit burn-in boards connected to connectors along edges of the burn-in boards at one end of the rack. The frame has a track for supporting the rack for movement from an open end toward a closed end of the oven. Driver/receiver boards are mounted at the closed end and have connectors aligning with the connectors on the burn-in boards on a rack. When the rack is moved to a position closely adjacent to the driver/receiver board connectors, alignment pins will align the rack properly and then actuators are used for moving inserter bars that press against the back side of the rack and push the connectors on the burn-in boards into the connectors on the driver/receiver boards. After the burn-in test is complete, and the rack is to be removed, the actuators will first move the inserter bars to clear the opening at the open end of the frame and then actuate ejector bars to push the rack and the supported burn-in boards in a direction to uncouple the connectors of the burn-in boards from the connectors on the driver/receiver boards.

Growing community of inventors

New Brighton, MN, United States of America

Tom Alan Tremmel