Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Alcatel

Ihp Gmbh Leibniz-Institut Für Innovative Mikroelektronik

Tolga Tekin

Hans-Hermann Oppermann

Charles-Alix Manier

Alexandre Shen

Fabrice Devaux

Kai Zoschke

Michael Schlak

Bernd Sartorius

Lars Zimmermann

Martin Wilke

Jean-Guy Provost

Ha Duong Ngo

Jörg Stockmeyer

Robert Gernhardt

Giannino Dziallas

Juliane Fröhlich

Cristopher Janz

Disclosed herein is an optical system, comprising a first optical component, featuring a first waveguide and a recess which passes at least partially through the first optical component from a front side to a back side, a second optical component, arranged in the recess of the first optical component, and a second waveguide optically coupled with the first waveguide, and a carrier substrate. The first optical component including a first marking set with a defined position/orientation relative to the first waveguide, the second optical component including a second marking set with a defined position/orientation relative to the second waveguide, and based on a relative position/orientation of the first and second marking sets, determine whether the first and the second optical components are aligned in a reference plane that is parallel to a surface of the carrier substrate, such that the first and the second waveguide are optically coupled.

Optical system, optical components, and method for manufacturing an optical system

An assembly may include at least one camera and a controllable mechanical handling device. The system may further include a first component, including a first optical waveguide and a second component, including a second optical waveguide. The first component and the second component are fixedly connected to a substrate and arranged directly next to one another on the substrate and relative to one another in such a way that a coupling side of the first component and a coupling side of the second component are situated opposite each other on a first and second side of a coupling plane. The optical waveguides of the first and second component each end at a first coupling surface or a second coupling surface. The first and second coupling sides are aligned, and optically coupled with one another at a first and second end face.

Assembly comprising a substrate and two components including optical waveguides, as well as method for production

Disclosed is a system for and a method of manufacturing of an optical system, including a first optical component, comprising a first waveguide and a carrier substrate, wherein the first optical component is arranged on the carrier substrate. The first optical component comprises a first markup set having a defined position/orientation with respect to the first waveguide, the carrier substrate has a second markup set detectable based on a relative position/orientation of the first and second markup sets when a desired orientation of the first waveguide relative to the carrier substrate is achieved in a reference plane extending parallel to a surface of the carrier substrate.

Markup system for optical system, carrier substrate, and method for manufacturing of same

A sensor device including a deflectable membrane made of a 2D nanomaterial, a first optical waveguide for guiding light, disposed adjacent to the membrane and extending along the surface of the membrane at least in a first section, as well as a measuring device for measuring, within the first section the influence of the membrane on an evanescent wave range of the light guided along the first optical waveguide. The influence of the membrane on the light guided in the optical waveguide, in particular on the evanescent wave range of the light, can be measured interferometrically by detecting phasing differences or phase shifts. This allows for a force-free readout of the membrane deflection. By using very thin 2D nanomaterials, the membrane can also react to very quick changes in force.

Sensor device

A method for manufacturing a semiconductor component including: providing a flat carrier with an upper side and a lower side, the carrier including a continuous opening that runs between the upper side and the lower side; providing a semiconductor arrangement that includes a semiconductor chip that includes electrically and/or optically active regions on a lower side; arranging the semiconductor arrangement in the opening such that a lower side of the semiconductor arrangement and the lower side of the carrier run in a common plane; casting the semiconductor arrangement with a potting compound, such that the semiconductor arrangement is materially connected to the carrier; and thinning out the semiconductor system by way of grinding from above, such that an upper side of the carrier and an upper side of the semiconductor arrangement run in a common plane.

Method for manufacturing a semiconductor component and a semiconductor component

An optical device for the differentiation of a first optical signal and an optical signal lagging behind the first, in which the differentiation is represented by a signal carried by a continuous wave passing through the two arms of an interferometer including media with an index that depends on the optical power passing through them. The delayed signal is the first signal fed back to one of the arms through a delay.

Optical differentiation device

Optical NRZ-RZ format converter

Growing community of inventors

Berlin, Germany

Tolga Tekin