Intel Corporation

Apple Inc.

Tolga Acikalin

Shengbo Xu

Chia-Pin Chiu

Omkar G Karhade

Bahareh Sadeghi

Richard D Roberts

Hassnaa Moustafa

Ioan Sauciuc

James G Maveety

Ashish Gupta

Javier Perez-Ramirez

Michael L Rutigliano

Kenneth Foust

James C Shipley

Christopher Wade Ackerman

Renzhi Liu

Christopher Roy Schroeder

Ravindranath Vithal Mahajan

Brandon C Marin

Sai Vadlamani

Tae Young Yang

Richard Dorrance

Melissa A Cowan

Zhen Zhou

Cheng-Yuan Chin

Tae-Young Yang

Sushrutha Gujjula

Kelly Lofgreen

Johanny Escobar Pelaez

The subject matter described herein presents various technical solutions for the technical problems facing autonomous vehicles (e.g., fully autonomous and semi-autonomous vehicles). To address technical problems facing wireless communication cost and latency, a heterogeneous roadside infrastructure can be used to improve the ability for a vehicle to communicate with a data source. To address technical problems facing interruption of vehicle services due to an abrupt loss of connection, a quality of service system provides the ability to determine and share quality of service information, such as location-based information, maps, interference data, and other quality of service information. To address technical problems facing high volume data upload and download between autonomous vehicles and cloud-based data services, optical wireless communication (OWC) provides increased data throughput and reduced complexity and may be beneficial for short-range high-mobility wireless communications.

Systems and methods for autonomous vehicle communication

The present disclosure relates to a device which includes a processor configured to: select, using sensor data, an error correction code from two or more error correction codes, the sensor data representing a physical state of the processor and/or the device; generate channel-coded data by channel-coding input data using the selected error correction code; and provide a representation of the channel-coded data to a transmitter for wireless data transmission.

Wireless device and methods for dynamic channel coding

An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate and a photonic integrated circuit device attached thereto, wherein the package substrate includes a heat dissipation structure disposed therein. A back surface of the photonic integrated circuit device may thermally coupled to the heat dissipation structure within the package substrate for the removal of heat from the photonic integrated circuit device, which allows for access to an active surface of the photonic integrated circuit device for the attachment of fiber optic cables and eliminates the need for a heat dissipation device to be thermally attached to the active surface of the photonic integrated circuit device.

Heat dissipation structures for optical communication devices

An electronic substrate may be fabricated having a core comprising a laminate including a metal layer between a first insulator layer and a second insulator layer, a metal via through the core, and metallization features on a first side and a second side of the core, wherein first ones of the metallization features are embedded within dielectric material on the first side of the core, and wherein a sidewall of the dielectric material and of the first insulator layer defines a recess over an area of the metal layer. In an embodiment of the present description, an integrated circuit package may be formed with the electronic substrate, wherein at least two integrated circuit devices may be attached to the electronic substrate. In a further embodiment, the integrated circuit package may be electrically attached to an electronic board. Other embodiments are disclosed and claimed.

Electronic substrate core having an embedded laser stop to control depth of an ultra-deep cavity

The subject matter described herein presents various technical solutions for the technical problems facing autonomous vehicles (e.g., fully autonomous and semi-autonomous vehicles). To address technical problems facing wireless communication cost and latency, a heterogeneous roadside infrastructure can be used to improve the ability for a vehicle to communicate with a data source. To address technical problems facing interruption of vehicle services due to an abrupt loss of connection, a quality of service system provides the ability to determine and share quality of service information, such as location-based information, maps, interference data, and other quality of service information. To address technical problems facing high volume data upload and download between autonomous vehicles and cloud-based data services, optical wireless communication (OWC) provides increased data throughput and reduced complexity, and may be beneficial for short-range high-mobility wireless communications.

In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element.

Package system and package

Techniques are disclosed for particulate matter (PM) measurement in a medium (such as air) using flat-top intensity laser sheet beam generation. The techniques for generating the laser sheet beam may include nonspecialized optical elements (e.g., aspherical, spherical, biconvex, and/or cylindrical lenses) that are cost-effective, reduce the overall footprint of the system, and also provide for relatively increased power efficiencies compared to conventional techniques. The PM measurement system may use the laser sheet beam generated in combination with a medium flow channel to pass the medium through the laser sheet beam, thereby causing particulates within the medium to scatter light, which can be detected using a light sensor (e.g., a photodetector). The scattered light signals can then be analyzed to match them with corresponding particulate sizes and the amount of signals per particulate size can also be determined to measure the size and count of particulates within the medium.

Particulate matter measurement using light sheet generation and scattering analysis

Systems and techniques are disclosed for flat-top intensity laser sheet beam generation. The system includes a source of light directed at a first optical component arranged to receive the light and generate spherical aberration (e.g., third order positive aberration) in the light rays. The spherical aberration results in positive aberrations in the light in a first plane and also results in the light being substantially collimated in a second plane perpendicular to the first plane. In some cases, the source of light is provided from a laser diode and the first optical component is one of an aspherical lens and a spherical lens. The system also includes a second optical component for focusing the light in the second plane. In some cases, the second optical component is a cylindrical lens.

System for flat-top intensity laser sheet beam generation

An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same

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San Jose, CA, United States of America

Tolga Acikalin