Other

Renesas Technology Corp.

Hitachi Transport System, Ltd.

Tokuji Toida

Hiromichi Suzuki

Hiroaki Tanaka

Kunihiro Tsubosaki

Kazunari Suzuki

Fujio Ito

Akihiko Kameoka

Takafumi Konno

Shigeki Tanaka

Wahei Kitamura

Toshimasa Shirai

A method for carrying a semiconductor device includes: (a) providing semiconductor devices each having a main surface, a back surface, and a plurality of external terminals; (b) providing a tray having a front surface, a rear surface, an electronic tag imbedded in the tray, first concaved portions formed on the front surface, second concaved portions formed on the rear surface, the electronic tag constituted by a non-contact recognition type chip having a memory circuit in which recognizable information is stored, a depth of the first concaved portion is deeper than a depth of the second concaved portion; (c) housing the semiconductor devices into the first concaved portions respectively in such a manner that the back surface of the semiconductor device being oppose to a bottom of the first concaved portion; and (d) carrying the tray with the semiconductor devices.

Method for carrying a semiconductor device

In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the thickness. The inner leads are secured to the heat radiation plate. Fastening the inner leads to the heat radiation plate supports the latter and eliminates the need for suspending leads. A lead pitch p, the lead width w and lead thickness t of the inner lead tips connected to the semiconductor chip have the relations of w<t and p&lE;1.2t, with the inner leads secured to the heat radiation plate. The heat radiation plate has slits made therein to form radially shaped heat propagation paths between a semiconductor chip mounting area and the inner leads. In a molding member-sealed semiconductor device wherein the semiconductor chip is fixed to the heat radiation plate, the tip thickness t&prime; of the inner leads is made less than the thickness t of the other portions of the inner leads secured to the heat radiation plate.

Semiconductor device

Method of making semiconductor device having improved heat radiation plate arrangement

Growing community of inventors

Hamura, Japan

Tokuji Toida