Matsushita Electric Works, Ltd.

Tokio Yoshimitsu

Yoshihide Sawa

Motoyuki Toki

Akinori Hibino

Hidekazu Takano

Kenzi Ogasawara

Yasuo Tohrin

Shingo Yoshioka

Tadao Ohnaka

Yuen C Tak

Yang Wu

Hideto Misawa

Kouji Sato

Motoyuki Akamatsu

An internal composite layer for a multilayer circuit board, which is composed of an electrically insulating substrate with a copper layer formed thereon and a film of a coupling agent covering the copper layer is fabricated in accordance with the following method. That is, the copper layer is treated with a base or the base and an accelerating agent to supply hydroxyl groups to a surface thereof. Subsequently, thus treated copper layer is coated with the coupling agent, e.g., a silane coupling agent. The coupling agent is chemically bonded to the treated copper layer by the reaction of the hydroxyl groups with the coupling agent, so that an adhesion strength between the copper layer and the coupling agent is remarkably increased. In addition, since it is not necessary for forming a copper oxide layer in the surface of the copper layer, the internal composite layer shows excellent acid resistance without causing a pink-ring which usually occur around a through-hole plating.

Method of fabricating an internal composite layer composed of an

A polyimide composition is obtained by adding triallyl isocyanurates to polyimide, preferably with further addition of an accelerator and diluting solvent. The composition is made to show effective reduction in dielectric constant as well as in the inherent viscosity and surface tension so that, when employed in manufacturing laminates, the degree of impregnation into base material can be elevated to remarkably improve resin filling.

Polyimide composition and prepreg and laminate thereof

A method for manufacturing a multilayer laminate provides in metal plates each forming a substrate apertures at positions where through holes are to be formed, fills the apertures with a synthetic resin including a first filler, and prepares prepregs to be disposed on both sides of each substrate by impregnating nonwoven fabric with a thermosetting synthetic resin containing a second filler. The metal plates forming the substrates are thereby allowed to be thicker for realizing larger capacity power supply with an improvement also in heat dissipation characteristics.

Method of manufacturing multilayer laminate

A resin-impregnated base of which total quantity of resin absence regions is restricted to be below a predetermined value, whereby a metal-foil coated laminate of the resin-impregnated bases is made obtainable continuously through a hot-compression molding under a low pressure, while restraining in particular void generation to maintain the dimensional change rate of the laminate to be minimum.

Resin-impregnated base and method of manufacturing same

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Kadoma, Japan

Tokio Yoshimitsu