Nidec Corporation

Tokichi Ito

Nobuaki Watanabe

Hiroyuki Yonei

Yoshito Oku

Yuichiro Yoshimura

Yoshinori Sakemoto

A base plate defines a portion of a housing of a disk drive device. The housing accommodates therein a disk, a spindle motor that rotationally drives the disk about a center axis that extends in a vertical direction, and an access portion that carries out at least one of reading or writing of information with respect to the disk. The base plate includes a cast metal base body and an electrodeposition coating film that covers the surface of the base body. The base body includes a bottom plate portion extending from the center axis to an outward in a radial direction and a wall portion with a rectangular or substantially rectangular shape viewed in the axial direction upward from an outer circumference portion of the bottom plate portion. An outside surface of the wall portion includes a coated surface covered with the electrodeposition coating film, a processing surface which is flat and on which a casting material is exposed from the electrodeposition coating film, and a parting line. The processing surface extends in the axial direction in contact with the parting line or across the parting line.

Base plate with electrodeposition coating film and method for producing base plate

The present invention provides a method for sealing a metal housing member. A housing through hole is formed in a housing member for a lead wire sealing device. The housing member is provided with a housing through hole formed on the metal housing member and penetrates from a closed space to an open space. A resin coating layer is formed to cover a lower surface of the housing member. A metal surface exposed part is formed on a part of the resin coating layer. The circuit board having a board aperture is mounted on the metal surface exposed part via an adhesive layer while overlapping with the board aperture on the housing through hole. The lead wire is inserted in the housing through hole and the board aperture that are overlapped with each other. The sealing material is provided on the circuit board to cover the board aperture.

Sealing method for through hole formed in metal housing

A first metal housing memberis provided with a bottom plate partand a resin coating layerformed on a lower surface of the bottom plate part. To a board mounted partwhich is a metal surface exposed part exposed from the resin coating layeraround a housing through hole, an FPCis mounted via an adhesive layer. A lead wireof a stator windingsthat is inserted in a board apertureis connected to the FPCby a sealing materialas a solder and the board apertureis covered with the sealing materialto seal the housing through hole. A motor unitcan securely seal the housing through holeby enhancing adhesiveness between the FPCand the first metal housing member

Lead wire sealing device, recording disk drive, and method for sealing housing member

According to a lead wire sealing device of an example of the present invention, a bushis inserted in a housing through holeformed in a bottom plate memberand a lead wireis inserted in the inside of the bush. A first adhesiveis loaded in the inside of the bush, the first space S, the second space Sand the third space S. A second adhesivecovers the first adhesiveat the edge where a flange portionof the bushis provided. The first adhesivehaving a lower viscosity is easily inserted in the first space Sby a capillary action to be loaded without a space. As a result, it is possible to certainly seal the first space S

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Kyoto, Japan

Tokichi Ito