Panasonic Corporation

Tohru Yamaoka

Hiroshi Ogura

Yuichi Miyoshi

Yusuke Takeuchi

Tomoyuki Sasaki

Hidenori Notake

An electret condenser includes a fixed filmincluding a conductive filmto be an upper electrode, a vibrating filmincluding a lower electrodeand a silicon oxide filmto be an electret film, and a silicon oxide filmprovided between the fixed filmand the vibrating filmand including an air gapRespective parts of the fixed filmand the vibrating filmexposed in the air gapare formed of silicon nitride filmsand

Electret condenser

A MEMS device, including: a substrate having a first principal plane and a second principal plane opposite to the first principal plane; a through hole formed in the substrate; and a vibrating film formed over the first principal plane so as to cover the through hole. The first principal plane and the second principal plane are both a (110) crystal face; and the through hole has a substantially rhombic shape on the second principal plane.

MEMS device and method for manufacturing the same

An electret condenser microphone includes: a substratein which an openingis formed; an electret condenserconnected to one face of the substrateso as to close the openingand having an acoustic holeand a cavity; a drive circuit elementconnected to the one face of the substrate; and a casemounted over the substrateso as to cover the electret condenserand the drive circuit element. Electric contact is established at a joint part between the electret condenserand the substrate. The acoustic holecommunicates with an external space through the opening. The cavityand an internal region of the caseserve as a back air chamber for the electret condenser

Electret condenser microphone

A diaphragm structure for a MEMS device includes a through-hole formed so as to penetrate from an upper surface to a bottom surface of a substrate; and a vibrating electrode film formed on the upper surface of the substrate so as to cover the through-hole. An opening shape of the through-hole in the upper surface of the substrate is substantially hexagonal.

Diaphragm structure and MEMS device

A MEMS device includes a first insulating film formed on a semiconductor substrate, a vibrating film formed on the first insulating film, and a fixed film above the vibrating film with an air gap being interposed therebetween. The semiconductor substrate has a region containing N-type majority carriers. A concentration of N-type majority carriers in a portion of the semiconductor substrate where the semiconductor substrate contacts the first insulating film, is higher than a concentration of N-type majority carriers in the other portion of the semiconductor substrate.

MEMS device, MEMS device module and acoustic transducer

An electric condenser includes a fixed filmincluding a conductive filmto be an upper electrode, a vibrating filmincluding a lower electrodeand a silicon oxide filmto be an electric film, and a silicon oxide filmprovided between the fixed filmand the vibrating filmand including an air gap. Respective parts of the fixed filmand the vibrating filmexposed in the air gapare formed of silicon nitride filmsand

An electret condenserincludes a fixed electrode, a vibrating electrode, an electretized silicon dioxide filmformed between the electrodes, and silicon nitride filmsandformed so as to cover the silicon dioxide film. The silicon dioxide filmcovered with the silicon nitride filmsandis formed on the vibrating electrode

A silicon nitride film () and a silicon nitride film () are formed to cover a charged silicon oxide film () serving as an electret.

Electret covered with an insulated film and an electret condenser having the electret

An electret condenser microphone includes: a substratein which an openingis formed; an electret condenserconnected to one face of the substrateso as to close the openingand having an acoustic holeand a cavitya drive circuit elementconnected to the one face of the substrateand a casemounted over the substrateso as to cover the electret condenserand the drive circuit elementElectric contact is established at a joint part between the electret condenserand the substrateThe acoustic holecommunicates with an external space through the openingThe cavityand an internal region of the caseserve as a back air chamber for the electret condenser

Growing community of inventors

Osaka, Japan

Tohru Yamaoka