Denki Kagaku Kogyo Kabushiki Kaisha

Tohru Umezaki

Yasuhisa Nishi

To provide an amorphous silica powder suitable for a sealing material for semiconductors having improved HTSL properties and HTOL properties, and a process for its production. An amorphous silica powder containing Al in an amount of from 0.03 to 20 mass % as calculated as AlOmeasured by atomic absorption spectrophotometry, wherein the average particle size is at most 50 &#x3bc;m, and when the amorphous silica powder is divided according to the average particle size into two powders, a powder having a particle size smaller than the average particle size has a higher content as calculated as AlOthan a powder having a particle size larger than the average particle size.

Growing community of inventors

Omuta, Japan

Tohru Umezaki