Sumitomo Chemical Company, Limited

Tohru Nagashima

Hideo Nomura

Hiroshi Nakamura

Manabu Hirakawa

Mituo Maeda

Koichi Mizumoto

Hiroshi Harada

Satoshi Okamoto

Noriaki Saito

Tadayasu Kobayashi

Yoshifumi Yoshida

A phenolic resin obtainable by reacting a dihydroxy compound of the following formula (1) with a phenolic compound,wherein the dihydroxy compound is partially dehydrated.

Phenolic resin and method of producing the same

By means of a liquid crystalline polyester resin composition containing 100 parts by weight of a liquid crystalline polyester forming an anisotropic melt phase, and not less than 0.01 part by weight and not more than 0.2 part by weight of at least one phosphite compounds defined by the formula (I):a liquid crystalline polyester resin composition capable of producing molded products having excellent thermal stability under high temperatures without causing occurrence of blister in the molded products even in the course of soldering.

Liquid crystalline polyester resin composition and molded product thereof

Process for producing thermotropic liquid crystalline polymer

A thermoplastic resin composition comprising an aromatic polysulfone resin and at least one resin selected from aromatic polyester resins, wherein the amount of alkali metal which exists in the aromatic polysulfone resin as a terminal phenolate is 50 ppm or less, and molded article thereof. This composition is excellent in heat resistance and melt-mold processability.

Aromatic polysulfone resin composition and molded article containing the same

Disclosed herein is a process for melt-bonding a molded article of a thermotropic liquid crystalline polyester with a metal, which comprises activating or irradiating a surface of a molded article of a thermotropic liquid crystalline polyester resin and melt-bonding the surface with a metal at or above the flow temperature of the thermotropic liquid crystalline polyester.

Process for melt-bonding molded article of liquid crystalline polyester with metal

A thermoplastic resin composition comprising 100 parts by weight of two or more thermoplastic resins and 0.1 to 100 parts by weight of a polyester having the specific structure, the polyester being added to the thermoplastic resins, wherein a glass transition temperature is not less than 50&deg; C. and/or a deflection temperature under load is not less than 70&deg; C. The present invention provides a high heat-resistant thermoplastic resin composition which is superior in mechanical physical properties and stress crack resistance.

Thermoplastic resin composition

Provided is a liquid crystalline polyester resin for extrusion molding having a solder heat resistant temperature of 250.degree. C. or more, wherein the ratio ((viscosity 2b)/(viscosity 1b)) of the melt viscosity (viscosity 1b) under a shearing speed of 1000/sec at the flow initiation temperature and the melt viscosity (viscosity 2b) under the same shearing speed at a temperature 20.degree. C. higher than the flow initiation temperature is from 0.10 to 0.70. The extrusion molding material of the above-described liquid crystalline polyester resin has excellent heat resistance, and can provide an extrusion molded article, especially a film having excellent appearance.

Liquid crystalline polyester resin for extrusion molding

A thermoplastic resin composition in which 5 to 45 parts by weight of carbon fiber and 0.1 to 10 parts by weight of conductive carbon black are compounded per 100 parts by weight of resin components comprising an aromatic polycarbonate resin and an aromatic polysulfone resin. The thermoplastic resin composition is excellent in heat-resistance and mechanical strength, and heat-resistant IC trays therefrom are useful products which can endure drying of IC at high temperature and are excellent in handling properties.

Thermoplastic resin composition and heat-resistant tray for IC

An aromatic polysulfone resin composition contains 100 parts by weight of an aromatic polysulfone resin and 0.001-50 parts by weight of at least one compound selected from oxides, peroxides, double oxides and carbonates of a metal belonging to the Group IA or IIA in the periodic table of elements and having a water absorption of 2% or less.

Aromatic polysulfone and Group IA or IIA metal oxide or carbonate

A thermoplastic resin composition includes (a) 1 to 99% by weight of a liquid crystalline polyester and (b) 99 to 1% by weight of a polyester as indispensable components, wherein the polyester is composed of the repeating units represented by the following formulas I, II and III in a specific ratio, ##STR1## wherein, X is --SO.sub.2 --, --CO--, --O--, --S--, --CH.sub.2 --, --CH.sub.2 --CH.sub.2 --, --C(CH.sub.3).sub.2 --, or a single bond; R.sub.1 represents an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 3 to 10 carbon atoms, a phenyl group, or a halogen atom; p is an integer of 0 to 4; m and n are integers of 1 to 4; a plurality of R.sub.1 on the same or different nuclei may be the same or different, and each p may be the same or different.

Thermoplastic resin composition and its molded article

A thermoplastic resin composition comprising an aromatic polycarbonate resin and an aromatic polysulfone resin and having the specific melt viscosity ratio between the two resins in the composition. This composition is excellent in heat resistance and gives a molded article of especially high temperature of deflection under load.

Thermoplastic resin composition and molded article

A liquid crystalline polyester resin composition includes 0.1-50 parts by weight of at least one or more inorganic compounds selected from oxides, peroxides, double oxides and hydroxides of calcium, sodium, barium or zinc added to 100 parts by weight of a liquid crystalline polyester. The invention provides a liquid crystalline polyester resin composition from which a very small amount of corrosive gas is generated when molded into a product. The composition exhibits mechanical strength and heat resistance essentially present in the liquid crystalline polyester resin and is suitable for electrical or electronic parts.

Growing community of inventors

Tsukuba, Japan

Tohru Nagashima