Fujitsu Corporation

Tohru Harada

Yoshiaki Yanagida

Hirokazu Yamanishi

Kiyoshi Taninaka

Akihiko Yabuki

Mitsuo Takeuchi

Kazuhisa Mishima

Toru Okada

Taizan Kobayashi

Yukio Ozaki

Toshinori Kasuga

Masanori Fukushi

Eiji Takada

Hirofumi Ohsawa

An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

Apparatus for mounting electronic component

An electronic component repair method for removing an electronic component soldered on a substrate, the method includes: mounting a heat transfer plate on the electronic component to be removed, the heat transfer plate being formed by bonding a plurality of heat transfer members via a heat insulating member, heating the heat transfer plate mounted on the electronic component by a heating unit, the heating unit heating individually each of the heat transfer members by different heat amount; and removing the electronic component from the substrate after the heating.

Electronic component repair method

A second valve is opened to combine an injection-pressure generating pressure with a maintaining pressure into an injection pressure. After the injection pressure is applied to a capillary to cause discharge of an object therefrom, an output pressure of a regulator is set to the injection pressure. Then, a first valve is opened to reapply the injection pressure to the capillary. The second valve is opened to combine a maintaining-pressure generating pressure with the injection pressure into the maintaining pressure. After the maintaining pressure is applied to the capillary to terminate the discharge of the object, the output pressure of the regulator is set to the maintaining pressure. Then, the first valve is opened to reapply the maintaining pressure to the capillary.

Discharge volume control method, discharge pressure control method, and microbody forming method

Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate.

Film sticking device, film sticking method, and electronic paper manufacturing method

An alignment apparatus for a planar member includes, an image capturing unit which captures an image of a rotationally asymmetrical alignment mark provided on the planar member, a position detection unit which detects a position of the alignment mark from the image, a position adjusting unit which adjusts, based on the detected position of the alignment mark, the position of the planar member relative to a reference position, and an orientation detection unit which detects an orientation of the planar member based on the rotational asymmetry of the alignment mark captured in the image.

Alignment apparatus and fabrication apparatus for planar member and alignment method and fabrication method for planar member

A vibration extraction processing unit extracts a deflection component synchronous with a rotation from a clock signal of a non-contact sensor so as to correct a clock jitter. A clock generating unit generates a clock signal of any format frequency preliminarily set up according to the clock signal from the vibration extraction processing unit. A sector correction processing unit measures an error due to the frequency deflection so as to correct the writing start position for the format pattern signal of each sector containing a servo frame signal stored in a memory according to the measured error. Writing processing units read out the corrected format pattern signal from the memory according to a synchronous signal corresponding to a single turn of a disc and a format frequency clock signal and then writes into a disc medium face.

Growing community of inventors

Kawasaki, Japan

Tohru Harada