Siemens Medical Solutions Usa, Inc.

Todor Sheljaskow

Sevig Ayter

Stephen Roy Barnes

Worth B Walters

Gregg W Frey

William John Park

Vaughn R Marian

David A Petersen

Amin M Hanafy

Robert Nolen Phelps

Mirsaid Seyed Bolorforosh

Nelson H Oliver

Timothy L Proulx

Xiaocong Guo

Grazyna M Palczewska

Stephen C Englund

Ron Ho

Thomas G Houck

Peter Guo

Walt T Wilser

Mirsaid S Boloforosh

Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electric current through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical conduction through the thickness or range dimension of the matching layer are provided. For example, vias, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the electroceramic material, in one step.

Electrically conductive matching layers and methods

An ultrasound transducer assembly is disclosed having a housing, a transducer array mounted in the housing and an electronics assembly mounted in the housing, the electronics assembly including one or more sub-assemblies having heat generating components disposed thereon. The electronics sub-assemblies further include thermal conducting features which conduct heat generated by the heat generating components out of the electronics assembly where it can be further removed by other thermal management techniques. These other thermal management techniques may include techniques utilized to cool the transducer array.

System and method for actively cooling transducer assembly electronics

A multi-dimensional transducer array has pitch along one dimension less than the pitch along a second dimension. The multi-dimensional transducer array with the same or different pitch is manufactured from a plurality of modules. Each of the modules are separately diced and then aligned and combined. Elements of a transducer array are used for isolating a transmit channel from a receive channel. Separate signal lines or traces are provided individually for each element on opposite sides of each element. A transmit channel may connect to one electrode on an element, and the receive channel may connect to an opposite electrode on the element. A multi-dimensional array is provided for time division multiplex processing. A probe houses the multi-dimensional array and a multiplexer.

Multi-dimensional transducer arrays and method of manufacture

Methods and systems for electronically scanning within a three dimensional volume while minimizing the number of system channels and associated cables connecting a two-dimensional array of elements to an ultrasound system are provided. An array of semiconductor or micro-machined switches electronically interconnect various elements of the two-dimensional array. Elements associated with a substantially same time delay are connected together as a macro element, reducing the number of independent elements to be connected to beamforming or system channels. To beam form in the desired direction, the macro elements are configured as a phased array or along substantially straight lines in at least two dimensions (i.e. along the face of the two-dimensional transducer). Such macro elements allow transmission and reception along beams that are at an angle other than normal to the two-dimensional transducer array. Beams at such angles may be used to acquire information beyond the azimuth and elevation extent of the two-dimensional array. Various configurations of macro elements are possible. For example, the macro elements in each configuration are parallel across the two-dimensional array, but different configurations are associated with rotation of the macro elements such that each configuration is at a different angle on the two-dimensional array. As another example, the macro elements are configured in a plurality of separate rows of parallel macro elements (i.e. configured as a 1.25D, 1.5D or 1.75D array of macro elements). Two or more switches are provided for each system channel, allowing for rotation of macro. elements. The different rotation positions of macro elements defines different two-dimensional scan planes within the three-dimensional volume. Two, three or more switches are provided for each element to interconnect the elements in many possible combinations.

Two dimensional array switching for beamforming in a volume

A transducer system and method for harmonic imaging is provided. At least one transducer element is provided. The transducer element comprises two or more stacked piezoelectric layers. Information from each of the layers is independently processed during one of a transmit event, a receive event, and both transmit and receive events. Information from the transducer element is provided to a filter. The filter isolates harmonic information for imaging. By providing a multi-layer transducer element with independent processing for each layer, a wide bandwidth transducer for harmonic imaging is provided. The null associated with most transducers at the second harmonic of a fundamental frequency is removed or lessened.

Ultrasound selectable frequency response system and method for multi-layer transducers

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Issaquah, WA, United States of America

Todor Sheljaskow