Hutchinson Technology Corporation

Todd W Boucher

Jeffry S Bennin

Brent D Lien

Gary E Gustafson

Ryan A Jurgenson

Jeffrey W Green

Michael T Hofflander

James H Dettmann

Dean E Myers

Lloyd C Goss

Anthony J Liberko

Karupanan Supramaniam

Raymond A Loehlein

Gabriel M Montes

Robert J Matz

Kevin D Bjork

A method of forming a flexure for an integrated lead head suspension with a metal spring layer, a conductive lead layer and an insulator layer between the metal spring layer and the conductive lead layer. The method includes forming insulator suspended portions on a lower surface of the conductive lead layer and further includes forming insulator spring arm portions on an upper surface of the metal spring layer adjacent to the insulator suspended portions.

Method of making integrated lead suspension flexure with balanced parallel leads for insulator layer hygrothermal compensation

A trace interconnect assembly designed for transmitting electrical signals to and from a head assembly in a hard disk drive is disclosed. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.

Magnetic head suspension with single layer preshaped trace interconnect

A flexure for an integrated lead head suspension comprising a metal spring layer having a metal base region, a metal head bonding platform, and one or more metal spring arms connecting the metal head bonding platform to the metal base region for flexure motion. The flexure also includes a conductive lead layer having lead base region portions extending over the metal base region and lead suspended portions spaced from and adjacent to at least one of the metal spring arms. The flexure further includes an insulator layer between the metal spring layer and the conductive lead layer that has insulator base region portions for bonding the lead base region portions to and insulating the lead base region portions from the metal base region. The insulator layer also has insulator suspended portions on a lower surface of the lead suspended portions and insulator spring arm portions on an upper surface of the metal spring arms adjacent to the lead suspended portions. A first curvature is induced on each insulator suspended portion and a second curvature is induced on each insulator spring arm portion when the insulator layer undergoes volumetric variations. The direction of the second curvature generally opposes the direction of the first curvature, and the second curvature in the insulator suspended portions compensates for the first curvature in the insulator spring arm portions.

Integrated lead suspension flexure with balanced parallel leads for insulator layer hygrothermal compensation

A trace interconnect assembly is designed for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.

An integrated lead suspension flexure including a metal spring layer having a metal base region, a metal head bonding platform, and one or more metal spring arms connecting the metal head bonding platform to the metal base region for flexure motion. The flexure also includes a conductive lead layer having a surface facing the metal spring layer and extending between the metal base region and the metal head bonding platform. The conductive lead layer has lead base region portions extending over the metal base region, lead metal-backed arm portions extending over the metal spring arms, and lead suspended portions extending from at least one of the lead metal-backed arm portions. The flexure further includes a hygroscopic insulator layer between the metal spring layer and the conductive lead layer having insulator base region portions for bonding the lead base region portions to and insulating the lead base region portions from the metal base region, insulator metal-backed arm portions for bonding the lead metal-backed arm portions to and insulating the lead metal-backed arm portions from the metal spring arms, and insulator suspended portions on the lower surface of the lead suspended portions. A first curvature is induced on each insulator metal-backed arm portion and a second curvature is induced on each insulator suspended portion when the insulator layer undergoes volumetric variations. The insulator metal-backed arm portions and insulator suspended portions have a serial arrangement so that the direction of the first curvature opposes the direction of the second curvature.

Integrated lead suspension flexure with serially arranged metal-backed

An integrated lead disk drive suspension including a load beam and one or more conductive leads. The load beam has a mounting region on a proximal end, a head bonding platform on a distal end, and one or more spring regions connecting the head bonding platform to the mounting region. The conductive leads are integrated with and insulated from the load beam by an adhesive dielectric layer, and extend between the head bonding platform and the mounting region. The leads are adapted to reduce mechanical effects of the leads and/or dielectric layer on spring characteristics of the spring regions. One embodiment of the leads includes at least a first compensating portion which extends off the load beam and traverses a nonlinear path around at least a portion of one or more of the spring regions. In another embodiment the portions of the conductive leads extending between the distal end of the load beam and the head bonding platform are substantially free from the dielectric layer. In yet another embodiment the width of portions of the dielectric layer is about equal to or less than the width of adjacent portions of the conductive leads.

Hygrothermal load compensating structures in an integrated lead

Laminate structures for attachment to a head suspension assembly in a hard disk drive. The laminate structures include a spring metal layer, a conductive layer, and an intermediate insulator/adhesive layer. The conductive layer can act as an interconnect assembly, as a gimbal, and as a spring region. The method of manufacture of the laminate structures incorporates manufacture of an interconnect assembly into the manufacture of spring structures such as a load beam or a gimbal. The laminate structures are manufactured by etching the layers from the outside in, using other layers as etching masks. Unique configurations are possible where either or both metal layers can be discontinuous, thanks to the manufacturing support of the second layer. The second layer can also be shaped into a plurality of panels, thus freeing the metal layers to act as the spring elements.

Laminated structures for a disk drive suspension assembly

Method of making laminated structures for a disk drive suspension

A trace interconnect assembly for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.

Electrical trace interconnect assembly

A method for manufacturing a head suspension including separately manufacturing a load beam and a set of traces. The traces are formed from a sheet of conductive material and include an elongated conductor portion and a gimbal portion. Portions of the traces which are configured to be mounted to the load beam are coated with dielectric before being mounted to the load beam. The gimbal portion of the traces provides both mechanical and electrical connections to the conductor portion.

Gimbal flexure and electrical interconnect assembly

A gimbal flexure and electrical interconnect assembly for attachment to a disk drive suspension assembly. The gimbal flexure and electrical interconnect acts both as an interconnect system for relaying electrical signals and as a gimbal flexure. It comprises a self-supporting set of generally parallel traces--electrically insulated linear substrate-free conductors constructed of a single layer spring material. The set of traces includes a load beam portion extending over and matching the surface topology of at least a section of the first surface of a load beam, and a gimbal portion located at a distal end of the set of traces shaped as a gimbal flexure means. The invention describes specific embodiments, including head harnesses, suspension assemblies, and head suspension assemblies, as well as manufacturing methods.

An electrical head interconnect assembly is fabricated for installation upon the suspension member supporting a magnetic read/write head over a rotating storage disk of a magnetic disk drive. A head interconnect is comprised of a film carrier strip upon which conducting elements are positioned and bonded. The carrier strip can be of plastic, metallic, cellulosic, or composite construction. The conducting elements, fabricated of 1 or more twisted or parallel lengths, are routed along a prepatterned carrier strip defining the X, Y, and Z coordinate positioning required to mate with a suspension member without manual routing or manipulation. In addition, the conducting elements are fixedly spaced with stripped insulation at both termination points of the interconnect (electronics and head) allowing prepositioned, automatable bonding to connective pads. A suspension member positioned and bonded within the strip at appendage sites, completes the installation of the conducting elements upon the suspension. The carrier then serves to secure the conductors and suspension within the protective framework of the strip and provides patterned tooling references until excised upon completion of head suspension assembly.

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Stewart, MN, United States of America

Todd W Boucher