Intel Corporation

Todd Spencer

Robert L Sankman

Sairam Agraharam

Guotao Wang

Thomas J De Bonis

Shengquan Ou

Yang Sun

An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.

Growing community of inventors

Chandler, AZ, United States of America

Todd Spencer