Apple Inc.

Todd S Mintz

James A Curran

Isabel Yang

Sonja R Postak

James A Yurko

Abhijeet Misra

Zechariah D Feinberg

Christopher D Prest

Brian S Tryon

Daniel T McDonald

Hoishun Li

Brian M Gable

Eric W Hamann

Lei Gao

Shi Hua Zhang

Yu Yan

Yi Chun Chen

Lijie Bao

James A Dean

Jeremy Li

Justin Memar-Makhsous

Chuan Liu

Kar-Wai Hon

Daniel T Mcdonald

A chemical treatment process has been identified as a simple and effective means of improving the bonding of injection-molded polymer to titanium surfaces. This process forms an oxide layer on a titanium surface that includes a layered double hydroxide. The layered double hydroxide both raises the bond strength and minimizes air or water leakage. The process enables the use of titanium alloys with injection molded polymer structural bonds in strong, lightweight, and water-resistant enclosures for consumer electronics.

Porous oxide for improved titanium-polymer bonding

An enclosure for an electronic device includes a titanium-aluminum clad substrate and an anodic oxide coating disposed on the titanium-aluminum clad substrate. The anodic oxide coating includes a density of between about 2.1 g/cmand about 2.4 g/cmor includes a maximum porosity between about 21% and about 31% and can be exposed to a temperature of over 150° C. without cracking or crazing.

Anodic oxide coating with high temperature tolerance

A component for an electronic device can include a part including a first metal and a second metal diffusion bonded to the first metal. The first metal can be aluminum and the second metal can be different from the first metal. A porous aluminum oxide layer can overlie a portion of the first metal and can be disposed adjacent to an interface between the first metal and the second metal. The component can further include a non-metallic material bonded to the part and extending into pores defined by the porous aluminum oxide layer.

Non-aqueous aluminum anodizing

A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.

Electronic device including clad components

This application relates to an enclosure for a portable electronic device. The enclosure includes an aluminum alloy substrate and an anodized layer overlaying and formed from the aluminum alloy substrate. The anodized layer includes pores, where the pores include (i) dye particles that impart the anodized layer with a color, and (ii) divalent metal cations.

Dye solution alternatives for reduced dye uptake in anodized layers

This application relates to a multi-piece enclosure for a portable electronic device. The enclosure includes a metal part including a metal substrate and a metal oxide layer overlaying the metal substrate, the metal oxide layer having an external surface that includes openings that lead into undercut regions. The openings are characterized as having a first width, and the undercut regions are characterized as having a second width that is greater than the first width. The enclosure further includes a non-metallic bulk layer including protruding portions that extend into the undercut regions such that the non-metallic bulk layer is interlocked with the metal part.

Etching for bonding polymer material to anodized metal

This application relates to a part for a portable electronic device. The part includes a titanium alloy substrate including a network of branching channels. The branching channels include a first channel and a second channel, where the first channel is defined by a first channel wall that extends away from a first opening in the exterior surface, and the second channel is defined by a second channel wall that extends away from a second opening in the first channel wall.

Titanium part having an etched surface

An enclosure for a portable electronic device includes a titanium substrate having a textured surface that includes peaks separated by valleys, where the textured surface is characterized as having (i) an Sdq (root mean square gradient) that is greater than 0.2 micrometers, and (ii) a gloss value that is greater than 90 gloss units as measured at 60 degrees by a gloss meter.

Titanium parts having a blasted surface texture

An enclosure for a portable electronic device can include a titanium substrate defining a textured surface and a nominal surface. The titanium substrate can include a first region that extends above the nominal surface and a second region adjacent to the first region and extending below the nominal surface. A separation distance between an apex of the first region and a bottom of a trough defined by the second region can be at least 1 micrometer. A metal oxide layer can overlay the trough defined by the second region.

Titanium part having an anodized layer

This application relates to an enclosure for a portable electronic device. The enclosure includes a titanium substrate having a textured surface that includes randomly distributed peaks separated from each other by valleys, where tops of the peaks are separated from bottoms of the valleys by at least a minimum separation distance such that the textured surface is characterized as having an Sq (root mean square height) that is greater than 0.3 micrometers.

Textured surface for titanium parts

This application relates to a composite part that can include a non-metal layer having attachment features, and a metal part that is joined with the non-metal layer. The metal part can include a plurality of interlocking structures that are disposed at an external surface of the metal part, where each of the interlocking structures can include an opening characterized as having a first width, and an undercut region, where the opening leads into the undercut region, and the undercut region is characterized as having a second width that is greater than the first width such that the undercut region captures and retains one of the attachment features of the non-metal layer.

Etching for bonding polymer material to a metal surface

An electronic device such as a wristwatch may include a conductive housing. A corrosion-resistant coating may be deposited on the conductive housing. The coating may include transition layers and an uppermost alloy layer. The transition layers may include a chromium seed layer on the conductive housing and a chromium nitride layer on the chromium seed layer. The uppermost alloy layer may include TiCrCN or other alloys and may provide the coating with desired optical reflection and absorption characteristics. The transition layers may include a minimal number of coating defects, thereby eliminating potential sites at which visible defects could form when exposed to salt water. This may allow the electronic device to exhibit a desired color and to be submerged in salt water without producing undesirable visible defects on the conductive housing structures.

Electronic devices having corrosion-resistant coatings

This application relates to a method for forming an enclosure for a portable electronic device. The enclosure includes a metal substrate having a first b* value. The method includes forming an anodized layer that overlays and is formed from the metal substrate, wherein the anodized layer has a second b* value that is no greater than 0.3 of the first b* value and no less than 0.3 less than the first *b value.

Titanium surfaces with improved color consistency and resistance to color change

This application relates to an enclosure for a portable electronic device. The enclosure includes a titanium substrate having a textured surface that includes peaks separated by valleys, where the textured surface is characterized as having (i) an Sdq (root mean square gradient) that is greater than 0.2 micrometers, and (ii) a gloss value that is greater than 90 gloss units as measured at 60 degrees by a gloss meter.

This application relates to an enclosure for a portable electronic device. The enclosure includes a titanium substrate having interstitial nitrogen atoms, where the titanium substrate is characterized as having an a* value that is less than 1, a b* value that is less than 5, and an L* value that is more than 70.

Growing community of inventors

San Jose, CA, United States of America

Todd S Mintz