Intel Corporation

United Technologies Corporation

Todd R Coons

Edward F Pietraszkiewicz

Joe F Walczyk

Michael L Rutigliano

Abram M Detofsky

Christina E Botnick

Nitin A Deshpande

Atul Kohli

Edvin Cetegen

Srikant Nekkanty

Kuang C Liu

Gregorio R Murtagian

Xiaoqian Li

Kelly P Lofgreen

Joseph B Petrini

Nader N Abazarnia

Christopher Wade Ackerman

Wesley Brook Morgan

Morten S Jensen

Kevin J Klinefelter

Divya Pratap

Rene J Sanchez

Sruti Chigullapalli

James R Hastings

Victor Henckel

Paul J Schubring

Yang Jiao

Tuan Hoong Goh

Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

Package expanded beam connector for on-package optics

Embodiments described herein may be related to apparatuses, processes, and techniques related to incorporating photonics integrated circuitry into a base die, the base die including an optical interconnect at a bottom of the base die to transmit and to receive light signals from outside the base die. The top of the base die includes one or more electrical connectors that are electrically coupled with the photonics integrated circuitry. The base die may be referred to as the photonics die. A system-on-a-chip (SOC) may be electrically coupled with and stacked onto the top of the photonics die. Other embodiments may be described and/or claimed.

Stackable photonics die with direct optical interconnect

Embodiments described herein may be related to apparatuses, processes, and techniques related to active optical plugs used to cover optical connectors of a photonics package to protect the connectors. The active optical plugs may also be used to perform testing of the photonics package, including generating light to be sent to the photonics package and to detect light received from the photonics package as part of the test protocol. This allows testing the optical connection and the photonics package, without exposing the optical connections of the package to damage from dust or physical contact. Other embodiments may be described and/or claimed.

Active optical plug to optically or electrically test a photonics package

An apparatus for testing integrated circuits (ICs) , includes a first thermal contact structure having a first surface to interface with a heat source and an opposing second surface to interface with a device under test (DUT). A second thermal contact structure is above the first thermal contact structure and separated therefrom by a variable-resistance thermal interface (VRTI) structure operable to couple or decouple the first and second thermal contact structures from one another. The VRTI structure has a maximal thermal conductivity associated with a first state, and a minimal thermal conductivity associated with a second state.

Thermal switch for rapid thermal coupling and decoupling of devices under test

A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.

Conformable heat sink interface with a high thermal conductivity

Embodiments of alignment fixtures for integrated circuit (IC) packages, and related techniques, are disclosed herein. In some embodiments, an alignment fixture for an IC package may include: a first socket having a recess dimensioned to receive a first surface of the IC package and having a first magnet arrangement disposed outside of the recess, wherein the IC package has a second surface opposite to the first surface and has a first electrical contact element on the second surface; and a second socket having a second electrical contact element and having a second magnet arrangement. The first and second electrical contact elements may be aligned when the IC package is disposed in the recess, the IC package is disposed between the first and second sockets, and the first magnet arrangement is in a predetermined equilibrium relation with the second magnet arrangement to mate the first and second sockets.

Alignment fixtures for an integrated circuit packages

The diffusion opening in the cooling hole of an airfoil is formed by an EDM process in which the outwardly flaring sidewalls of the opening, rather then having surfaces that are approximated to be smooth by having many small ribs formed therein, are formed with relatively few ribs with both longitudinally extending and radially extending surfaces that are substantially greater in dimension than those as normally formed. In this manner, the machining process is simplified and expedited, while at the same time, the cooling efficiency is increased.

Article having diffuser holes and method of making same

A turbine blade airfoil assembly includes a cooling air passage. The cooling air passage includes a plurality of impingement openings that are isolated from at least one adjacent impingement opening. The cooling air passage is formed and cast within a turbine blade assembly through the use of a single core. The single core forms the features required to fabricate the various separate and isolated impingement openings. The isolation and combination of impingement openings provide for the augmentation of convection and film cooling and provide the flexibility to tailor airflow on an airfoil to optimize thermal performance of an airfoil.

Heat transferring cooling features for an airfoil

In one embodiment, the present invention includes a universal cover to be adapted to burn-in sockets, where at least some of the burn-in sockets have different dimensions. In this way, the universal cover enables an actuator plate of an actuator system having a fixed configuration of actuation members to open and close burn-in socket covers of different form factors. Other embodiments are described and claimed.

Universal cover for a burn-in socket

A turbine blade airfoil assembly includes a cooling air passage. The cooling air passage includes a plurality of impingement openings that are isolated from at least one adjacent impingement opening. The cooling air passage is formed and cast within a turbine blade assembly through the use of a single core. The single core forms the features required to fabricate the various separate and isolated impingement openings. The isolation and combination of impingement openings provides for the augmentation of convection and film cooling and provide the flexibility to tailor airflow on an airfoil to optimize thermal performance of an airfoil.

A hole-drilling guide for directing a flexible hole-drilling instrument includes; a body made of an electrically insulating material, at least one inlet aperture penetrating a face of the body, at least one exit aperture penetrating a face of the body and a hollow, nonlinear raceway linking the inlet and exit apertures.

Growing community of inventors

Gilbert, AZ, United States of America

Todd R Coons