Eastman-kodak Company

Global Oled Technology LLC

Eastman Kodak

Todd Mathew Spath

Ronald S Cok

Carolyn Rae Ellinger

Debasis Majumdar

Charles Chester Anderson

Lee William Tutt

Glen C Irvin, Jr

Thomas Nathaniel Tombs

Gary Alan Kneezel

Christopher B Liston

Lawrence A Rowley

Douglas Edward Garman

Shelby Forrester Nelson

David Andrew Johnson

Jayme Diniz Ribeiro

John W Hamer

Dustin Lee Winters

Bruce C Campbell

Barry Crouse

Ronald Steven Cok

Lawrence Allen Rowley

Glen Clifford Irvin

A thin film deposition system includes a vacuum-preloaded gas bearing deposition head positioned in an external environment having an ambient pressure, the deposition head having an output face including a plurality of source openings through which gaseous materials are supplied and one or more exhaust openings. An exhaust pressure at the exhaust openings is less than ambient pressure, and a source pressure at the source openings is greater than that at the exhaust openings, with the pressure at the outermost source openings being greater than ambient pressure. A motion control system moves a substrate unit over the output face in the in-track direction without constraining its motion in a direction normal to the output face to a point where a center of gravity of the substrate unit is beyond the first edge of the output face.

Deposition system with vacuum pre-loaded deposition head

An electrode film includes a first electrode pattern having a first set of parallel conductive electrodes and a second electrode pattern having a second set of parallel conductive electrodes disposed on a surface of a transparent film. The conductive electrodes in the first and second electrode patterns are conductive mesh patterns including a pattern of open areas and are arranged in an interlaced pattern. The first and second electrode patterns are configured to be connected to respective sources of electrical power supplying respective waveforms to generate a time-varying electric field pattern above a surface of the electrode film.

Open electrodes for in-plane field generation

A thin film deposition system includes a web guide system having a plurality of web guides defining a web transport path for the web of substrate. The web guide system includes a moveable portion including first and second moveable-position web guides. A web transport control system advances the web of substrate along the web transport path at a web advance velocity. A deposition head is located along the web transport path between the first and second moveable-position web guides. A motion actuator system synchronously moves a position of the first and second moveable-position web guides such that they move forward and backward according to a defined oscillating motion pattern while maintaining a constant distance between the first and second moveable-position web guides, thereby causing a portion of the web of media adjacent to the deposition head to move forward and backward in an in-track direction.

Deposition system with moveable-position web guides

An electrode film includes a first electrode pattern having a first set of parallel conductive electrodes and a second electrode pattern having a second set of parallel conductive electrodes disposed on a first surface of a transparent film, wherein elements of the first electrode pattern do not cross over elements of the second electrode pattern. A third electrode pattern having a third set of parallel conductive electrodes is disposed on a second surface of the transparent film, wherein the first, second and third sets of parallel conductive electrodes are arranged in an interlaced pattern. The electrode patterns are configured to be connected to respective power sources of electrical power supplying respective waveforms to generate a time-varying electric field pattern above a surface of the electrode film.

Double-sided electrodynamic screen films

A modular thin film deposition system, includes a machine base, a deposition head for depositing a thin film of material onto a process surface of a substrate, a motion actuator including a fixed portion and a moveable portion, and one or more interchangeable substrate positioner modules adapted to mount on the moveable portion of the motion actuator. The interchangeable substrate positioner modules include kinematic mounting features that engage with corresponding kinematic mounting features on the moveable portion of the motion actuator. The motion actuator moves the interchangeable substrate positioner in a motion direction, thereby moving the substrate in an in-track direction in a plane parallel to the output face of the deposition head during deposition of the thin film of material onto the process surface of the substrate.

Modular thin film deposition system

An electrode film is fabricated by using a flexographic printing system to print a first electrode pattern including a first set of parallel electrodes and a second electrode pattern including a second set of parallel electrodes onto a first surface of a transparent film using a catalytic ink, wherein elements of the first electrode pattern do not cross over elements of the second electrode pattern. The flexographic printing system prints a third electrode pattern including a third set of parallel electrodes onto a second surface of the transparent film using the catalytic ink, wherein the first, second and third sets of parallel electrodes are arranged in an interlaced pattern. A conductive metallic material is electrolessly plated onto the catalytic ink such that the elements of the first, second and third electrode patterns become conductive.

Fabricating double-sided electrodynamic screen films

A thin film deposition system includes a vacuum-preloaded gas bearing deposition head positioned in an external environment. The deposition head has a vertically-oriented output face including a plurality of source openings through which gaseous materials are supplied and one or more exhaust openings. An exhaust pressure at the exhaust openings is less than an ambient pressure, and a source pressure at the source openings is greater than the exhaust pressure, with the pressure at the outermost source openings being greater than the ambient pressure. A substrate positioner applies a vertical force onto a substrate unit, the vertical force passing through a center of gravity of the substrate unit. A motion control system moves the substrate positioner, thereby moving the substrate unit relative to the output face in an in-track direction without constraining the motion of the substrate unit in a direction normal to the output face of the deposition head.

Vertical system with vacuum pre-loaded deposition head

A gas-levitated substrate backing system includes a gas-levitating backer structure which is used for providing a non-contact force onto a surface of a substrate. The gas-levitating backer structure has an output face including three or more output openings. A gas source provides a gas flow through the output openings to levitate the gas-levitating backer structure over the surface of the substrate. The gas-levitating backer structure is freely moveable in a direction normal to the surface of the substrate.

Heated gas-bearing backer

A deposition unit for a thin film deposition system includes one or more of deposition heads and a gas manifold. Each deposition head includes an output face having a plurality of gas openings, a mounting face including a plurality of deposition head gas ports, and connecting gas passages. The gas manifold includes an attachment face having one or more interface regions, each interface region including a plurality of manifold gas ports in positions corresponding to the deposition head gas ports. Each deposition head is fastened to the gas manifold in an interface region with sealing elements positioned between the manifold gas ports and the deposition head gas ports. The mounting face of each deposition head and the attachment face of the gas manifold include alignment features for aligning each deposition head with the interface region of the gas manifold.

Deposition system with modular deposition heads

A material deposition system for depositing a material on a surface of a substrate includes a deposition head having an output face configured to simultaneously supply a plurality of gaseous materials in a sequence of gas zones. The gas zones include a deposition zone located between first and second inert zones. The deposition zone includes a first reactant zone adjacent to the first inert zone, a last reactant zone adjacent to the second inert zone, and one or more purge gas zones. A motion actuator moves a substrate over the output face with a repeating motion profile that prevents a region of active deposition on the substrate from being exposed to the external environment prior to having achieved a final material deposition amount. The repeating motion profile include a forward motion portion and a backward motion portion which is less than the forward distance by an ooch distance.

Deposition system with repeating motion profile

A dual gas-bearing system includes a vacuum-preloaded gas bearing, a substrate, and a gas-bearing backer. The vacuum-preloaded gas bearing is mounted to a machine base in a fixed location. The substrate has a first surface facing the output face of the vacuum-preloaded gas bearing and an opposing second surface facing the output face of the gas-bearing backer. The gas-bearing is freely moveable in a direction normal to the output face of the vacuum-preloaded gas bearing. A gas flow through the output face of the vacuum-preloaded gas bearing imparts a first net force onto the first surface of the substrate, and a gas flow through the gas-bearing backer imparts a second net force onto the second surface of the substrate, wherein the second net force and the gap between the output face of the gas-bearing backer are independent of the position and thickness of the substrate.

Dual gas bearing substrate positioning system

A deposition unit for a thin film deposition system includes a plurality of deposition heads. Each deposition head includes an output face having a plurality of gas slots extending in a cross-track direction. Two of the deposition heads are positioned adjacent to each other in the cross-track direction such that the adjacent deposition heads have abutting ends. The abutting ends of the adjacent deposition heads include interlocking structures having an alternating sequence of protrusions and recesses such that the protrusions on the abutting end of one adjacent deposition head fit into the recesses on the abutting end of the other adjacent deposition head. The gas slots extend into the protrusions on the abutting ends such that in an overlap region, the gas slots of one adjacent deposition head overlap with the gas slots of the other adjacent deposition head.

Deposition system with interlocking deposition heads

A multi-layer micro-wire structure resistant to cracking including a substrate having a surface, one or more micro-channels formed in the substrate, an electrically conductive first material composition forming a first layer located in each micro-channel, and an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking.

Multi-layer micro-wire structure

A method for aligning a second pattern to a first pattern based on a first alignment structure on a first substrate is disclosed. The alignment structure has a different magnitude of the electrical characteristic than the substrate. A controller controls the relative position of an electrical probe with respect to the substrate to measure the electrical characteristic corresponding at a plurality of positions proximate the substrate. The measured electrical characteristics are used to identify the location of the alignment structure by identifying a difference between the measured electrical characteristic at a pair of the plurality of positions exceeding a predetermined threshold. A second substrate having the second pattern including a second alignment structure formed thereon is aligned to the first substrate by a controller based on the identified locations of the first and second alignment structures.

Method for aligning patterns on a substrate

A method of making a multi-layer micro-wire structure resistant to cracking on a substrate having a surface including forming a plurality of micro-channels in the substrate, locating a first electrically conductive material composition forming a first layer in each micro-channel, and locating a second electrically conductive material composition having a greater tensile ductility than the first material composition to form a second layer in each micro-channel and in electrical contact with the first electrically conductive material composition thereby providing an electrically conductive multi-layer micro-wire in each micro-channel that is resistant to cracking.

Growing community of inventors

Hilton, NY, United States of America

Todd Mathew Spath