Applied Materials, Inc.

Todd J Brill

Amitabh Puri

Michael Teferra

David C Duffin

Daniel R Jessop

Glade L Warner

Paul Zachary Wirth

Mohsin Waqar

Jeffrey C Hudgens

Paul E Fisher

Ilias Iliopoulos

Ali Utku Pehlivan

Charles Gregory Potter, Sr

Implementations disclosed describe an inspection device capable of being transferred by a robot blade into a processing chamber of a manufacturing machine, the inspection device comprising an optical sensor to detect light reflected from a target located within the processing chamber, wherein the optical sensor is to output, to a processing device, a signal representative of a state of a region of a surface of the target.

Methods and systems of optical inspection of electronic device manufacturing machines

A method for finding a center of a process kit and/or a process kit ring is provided. An object placed on an end effector is moved past a sensor of a manufacturing system. A first signal indicating a current shape of object is received from the sensor of the manufacturing system. A determination is made whether the first signal corresponds to a second signal indicating a predefined shape for a process kit and/or a process kit carrier. In response to a determination that the first signal corresponds to the second signal, a coordinate correspondence is determined between coordinates of a center of the object and coordinates of a center of the end effector. The determined coordinate correspondence indicates whether a current placement of the object on the end effector satisfies a target placement criterion.

Centerfinding for a process kit or process kit carrier at a manufacturing system

In one aspect, a method is provided for electronic device manufacturing. The method includes receiving a request to transfer a carrier to or from a first substrate loading station of an electronic device manufacturing facility, and assigning one of a plurality of carrier supports to carry out the transfer based on a spacing on either side of the assigned carrier being greater than an acceptable spacing. Numerous other aspects are provided.

Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility

In a first aspect, a first method is provided for electronic device manufacturing. The first method includes the steps of (1) receiving a request to transfer a carrier from a first substrate loading station to a second substrate loading station of an electronic device manufacturing facility including a plurality of substrate loading stations, wherein the facility further includes a plurality of carrier supports coupled to a conveyor system adapted to move the carrier within the facility; (2) assigning one of the plurality of carrier supports to transfer the carrier from the first substrate loading station to the second substrate loading station such that at least one of a time required for the transfer is reduced and balance of the conveyor system is maintained; (3) moving the carrier from the first substrate loading station; and (4) moving the carrier to the second substrate loading station. Numerous other aspects are provided.

In a first aspect, a computer program product is provided. The computer program product includes a medium readable by a computer. The computer readable medium has computer program code adapted to (1) create a band map that indicates an expected status of one or more positions along a band of a continuously moving conveyor system, each position adapted to receive a carrier support adapted to transport at least one substrate carrier around an electronic device manufacturing facility; (2) monitor status of the one or more positions included in the continuously moving conveyor system; and (3) control operation of the continuously moving conveyor system based on the status of the one or more positions. Numerous other aspects are provided.

Growing community of inventors

Round Rock, TX, United States of America

Todd J Brill