Medtronic, Inc.

Todd H Schaefer

David B Engmark

Andrew J Ries

Christine Gale Kronich

Thomas I Ceballos

Gregory John Haubrich

Erik R Scott

Suping Lyu

Joachim Hossick-Schott

George Patras

Robert L Olson

Scott J Robinson

Kevin K Tidemand

Richard A Bruchmann

Gary M Grose

Ananta Pandey

Catherine M Asgian

David Engmark

Frame structures, assemblies and methods for use in implantable medical devices. The frames may include one or more first polymeric portions and one or more second polymeric portions coupled to the one or more first polymeric portions. The one or more first polymeric portions may have a higher durometer than the one or more second polymeric portions. The one or more second polymeric portions may provide an interference fit between the one or more second polymeric portions and the housing and/or between the one or more second polymeric portions and one or more components disposed in the housing.

Frames for implantable medical devices and methods

An implantable medical device includes a housing forming an internal cavity, the housing defining a profile with a height and a width and further defining a thickness perpendicular to its profile. The thickness of the housing is shorter than both the height and the width of the profile of the housing. The implantable medical device further includes at least one battery within the internal cavity, at least one capacitor adjacent the battery within the internal cavity, the capacitor and the battery being located along a common plane within the internal cavity, and circuitry within the internal cavity. The circuitry extends over both the battery and the capacitor within the internal cavity such that the circuitry is in a stacked arrangement relative to the battery and the capacitor.

Battery and capacitor arrangement for an implantable medical device

An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.

Assembly method for implantable medical device

An RF antenna flexible circuit interconnect is disclosed with unique micro connectors. The RF antenna flexible circuit interconnect further includes a planer flexible body having an embedded RF transmission line with a first end and a second end. A first antenna micro connector is electrically coupled to the first end of the RF transmission line and a second antenna micro connector is electrically coupled to the second end of the RF transmission line. Each of the first and second antenna micro connectors include an antenna micro connector housing and an antenna central contact socket securely positioned within the antenna micro connector housing. The antenna central contact socket may also include inward bending fingers and may be designed to engage a pin that is inserted into the central contact socket.

Radio frequency antenna flexible circuit interconnect with unique micro connectors

A laser ribbon bond pad array connector is disclosed for electrically connecting a RF module to an IMD circuit board in an implantable medical device. The array connector includes a connector body with a plurality of electrically isolated bonding fingers embedded in the connector body. Each bonding finger includes a solder pad that is on a first surface of the connector body and a laser ribbon bond pad that is on a second surface of the connector body. The first and second surfaces are spaced apart in angular relations thereof.

Laser ribbon bond pad array connector

In general, the invention is directed to an implantable medical device assembly having a more space-efficient housing and components, as well as processes for assembling the implantable medical device with reduced assembly cost and less complexity. The implantable medical device may incorporate a battery, capacitor, circuit assembly, feedthrough assembly, and interconnect assembly with respective electrical terminals. This configuration permits the use of automated electronic module assembly techniques such as parallel gap or ribbon bond welding to electrically connect the terminals. A feedthrough assembly may present a set of terminals adjacent a corresponding set of circuit terminals, also enabling the use of automated welding techniques.

Implantable medical device assembly and manufacturing method

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Blaine, MN, United States of America

Todd H Schaefer