Motorola Corporation

Todd F Miller

Gary J O'Brien

Ronald P Bieschke

An apparatus and method is disclosed for a semiconductor wafer front side pressure testing system ( ). Negative or positive pressure is applied to the top portion of a semiconductor wafer ( ) mounted on a support structure or wafer chuck ( ). In one embodiment, bellows ( ) coupled to the wafer chuck ( ) and a platen ( ) located above the semiconductor wafer ( ) provides a sealed atmosphere above the semiconductor wafer ( ) to permit negative or positive pressure to be introduced into this sealed atmosphere. In another embodiment, a seal is provided by a wall portion ( ) connected to the chuck ( ) contacting a gasket ( ) located beneath the platen ( ).

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Phoenix, AZ, United States of America

Todd F Miller