Cyberoptics Corporation

Todd D Liberty

John D Gaida

Theodore Paul Dale

Steven K Case

Timothy A Skunes

Carl E Haugan

Paul R Haugen

David Fishbaine

David D Madsen

David W Duquette

Thomas W Bushman

Lance K Fisher

Scott D Roth

Joseph L Horijon

Chuanqi Chen

Brant O Buchika

An electronics assembly line includes a first electronics assembly machine and a second electronics assembly machine. The first electronics assembly machine has a first electronics assembly machine outlet. The second electronics assembly machine has a second electronics assembly machine inlet and outlet. The inlet of the second electronics assembly machine is coupled to the outlet of the first electronics assembly machine by a conveyor. A first optical inspection sensor is disposed over the conveyor before the inlet of the second electronics assembly and is configured to provide first sensor inspection image data relative to a substrate that passes beneath the first optical inspection sensor in a non-stop fashion. A second optical inspection sensor is disposed over the conveyor after the outlet of the second electronics assembly machine and is configured to provide second sensor inspection image data relative to a substrate that passes beneath the second optical inspection sensor in a non-stop fashion. A computer is operably coupled to the first and second optical inspection sensors and is configured to provide an inspection result based upon at least one of the first and second inspection image data.

High speed distributed optical sensor inspection system

Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.

Pick and place machine with component placement inspection

An electronics assembly system includes an image acquisition system that is coupled to a controller through an improved interface. The coupling facilitates advanced monitoring and control of the image acquisition system. Multiple image acquisition systems can be coupled to the controller over the same interface.

Board align image acquisition device with improved interface

Growing community of inventors

Apple Valley, MN, United States of America

Todd D Liberty