Advantest Test Solutions, Inc.

Red.com, Inc.

Push, Inc.

Todd Berk

Samer Kabbani

Karthik Ranganathan

Gregory Cruzan

Paul Ferrari

Mohammad Ghazvini

Ikeda Hiroki

Kiyokawa Toshiyuki

Ian Williams

Thomas Carleton Jones

Craig Smith

John Anthony Hamming

Tom F Jones

Sean Lever

Brian McEvilly

James H Jannard

Peter Jarred Land

Thomas Jones

James H Jennard

Brian Mcevilly

A stand-alone active thermal interposer device for use in testing an unpackaged integrated circuit device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

Active thermal interposer device

A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

Test system including active thermal interposer device

DUT placement and handling for active thermal interposer device

Embodiments of the present invention provide systems and methods for performing automated device testing at high power using ATI-based thermal management that substantially mitigates or prevents the pads and pins thereof from being burned or damaged. In this way, the lifespan of the testing equipment is improved and the expected downtime of testing equipment is substantially reduced, while also reducing cost of operation.

High current device testing apparatus and systems

Testing system including active thermal interposer device

In one embodiment, a water resistant smart gauge is disclosed including a housing, a printed circuit board (PCB), a display device, a transparent circular pane, a rear cover, and one or more modules. The PCB is mounted in the housing and has one or more sets of electrical contacts, The display device is mounted in the housing. The transparent circular pane is sealed to a front side of the housing over the display device. The rear cover is sealed to a back side of the housing. The rear cover includes one or more expansion module have sealed openings around the one or more sets of electrical contacts of the PCB. The one or more modules each having a cylindrical shaft with a groove and a sealing ring mounted in the groove. When the cylindrical shaft of the one or more modules are plugged into the one or more expansion openings in the rear cover, they provide a water resistant seal for the smart gauge.

Water resistant smart gauge

Modular digital camera systems are disclosed. The modular digital camera system can include a brain module configured to be releasably coupled to one or more of a port extender module, power module, display module, and handle module. The brain module and other accessory modules can be structured according to some embodiments to increase an ease of coupling and decoupling the modules.

Modular motion camera

Modular motion camera including microphone and fan

Growing community of inventors

Rancho Santa Margarita, CA, United States of America

Todd Berk