Intel Corporation

Todd B Myers

Eric C Palmer

Jui Min Lim

Nicholas Randolph Watts

Renee M Defeo

Nicolas R Watts

A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.

Passive within via

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Method of embedding passive component within via

A method for forming an plurality of paths on a substrate includes drilling an opening for a via to a depth to expose a first pad and a second pad, lining the opening with a conductive material, and insulating a first portion of the lining in the opening from a second portion of the lining in the opening to form a first electrical path contacting the first pad and a second electrical path contacting the second pad.

Via including multiple electrical paths

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A system includes a device having at least one integrated circuit. The integrated circuit further includes a first layer of conductive material, a second layer of conductive material, and a via having multiple electrical paths for interconnecting the first layer of conductive material and the second layer of conductive material. A method for forming a via includes drilling an opening to a depth to expose a first pad and a second pad, lining the opening with a conductive material, and insulating a first portion of the lining in the opening from a second portion of the lining in the opening to form a first electrical path contacting the first pad and a second electrical path contacting the second pad.

Growing community of inventors

Gilbert, AZ, United States of America

Todd B Myers