Lsi Logic Corporation

Lsi Corporation

Honeywell International Inc.

Symbios, Inc.

Atmel Corporation

Symbios Logic Inc.

Honeywell G.m.b.h.

Avago Technologies General IP (singapore) Pte. Ltd.

Todd A Randazzo

Gayle W Miller

John De Q Walker

Cheng-Gang Kong

Kenneth P Fuchs

John J Seliskar

Edson Wayne Porter

Bradley J Larsen

Hong-Him Lim

Dharmesh N Bhakta

Paul S Fechner

David W Daniel

Geoffrey S Gongwer

John D Walker

Matthew Russell

Brian E Burdick

Kenneth Stanley Szajda

John Q Walker

Jan Kolnik

Venkatesh P Gopinath

Derryl D J Allman

Jonathan Alois Schmitt

Kenneth G Richardson

Scott C Savage

William K Petty

Thomas R Keyser

Peter J Wright

Cheisan J Yue

Verne C Hornback

David Owen Erstad

Ronald James Jensen

Curtis H Rahn

Gordon Alan Shaw

Samuel C Gioia

Hoang P Nguyen

Kevin J Bruno

Donald A Erickson

Timothy McGonagle

Stephen R Burnham

E Wayne Porter

A calibration circuit includes an amplifier, a current steering digital-to-analog converter (DAC), a comparator, a slew calibration network, and an on-die termination (ODT) network. The amplifier generally has a first input, a second input, and an output. The first input generally receives a reference signal. The current steering digital-to-analog converter (DAC) generally has a first input coupled to the output of the amplifier, a first output coupled to the second input of the amplifier, and a second output coupled to a circuit node. The comparator generally has a first input receiving the reference signal, a second input coupled to the circuit node, and an output at which an output of the calibration circuit may be presented. The slew calibration network is generally coupled to the circuit node and configured to adjust a slew rate of the calibration circuit. The on-die termination (ODT) network is generally coupled to the circuit node.

High speed multiple memory interface I/O cell

Neutron detection cells and corresponding methods of detecting charged particles that make efficient use of silicon area are set forth. Three types of circuit cells/arrays are described: state latching circuits, glitch generating cells, and charge loss circuits. An array of these cells, used in conjunction with a neutron conversion film, increases the area that is sensitive to a strike by a charged particle over that of an array of SRAM cells. The result is a neutron detection cell that uses less power, costs less, and is more suitable for mass production.

Neutron detector cell efficiency

An input/output (I/O) cell including one or more driver-capable segments and one or more on-die termination (ODT) capable segments. The I/O cell may be configured as an output driver in a first mode and Thevenin equivalent termination in a second mode.

A receiver circuit is provided on an integrated circuit. The receiver circuit includes first and second power supply terminals, a ground supply terminal, a resistive element coupled between the first and second power supply terminals, and a receiver biased between the second power supply terminal and the ground supply terminal. The receiver draws a bias current through the resistive element, which varies as a positive function with a voltage on the second power supply terminal. The voltage on the second power supply terminal varies as an inverse function of the bias current.

Resistive voltage-down regulator for integrated circuit receivers

A method of manufacturing a neutron detector comprises forming a first wafer by at least forming an oxide layer on a substrate, forming an active semiconductor layer on the oxide layer, and forming an interconnect layer on the active semiconductor layer, forming at least one electrically conductive pathway extending from the interconnect layer through the active semiconductor layer and the oxide layer, forming a circuit transfer bond between the interconnect layer and a second wafer, removing the substrate of the first wafer after forming the circuit transfer bond, depositing a bond pad on the oxide layer after removing the substrate of the first wafer, wherein the bond pad is electrically connected to the electrically conductive pathway, depositing a barrier layer on the oxide layer after removing the substrate of the first wafer, and depositing a neutron conversion layer on the barrier layer after depositing the barrier layer.

Neutron detector with wafer-to-wafer bonding

A fault tolerant driver circuit includes a data output driver that receives an enable input and that includes a transistor formed on an isolation well. A well bias circuit provides a first well bias to the isolation well. The well bias circuit includes voltage-controlled impedances that are controlled by a voltage of the data output line, the enable input and a supply voltage. The voltage-controlled impedances connect the first well bias alternatively to: a common conductor through a first impedance when the supply voltage is ON and the enable input is ON; and a second impedance when the supply voltage is on and enable is OFF.

Transceiver with fault tolerant driver

A hypersensitive semiconductor die structure is disclosed, in which flip-chip packaging is used in conjunction with a modified SOI die in which a thick silicon support substrate has been removed to increase sensitivity of the sensing device. Rather than being located beneath layers of interconnects and dielectric, the disclosed structure places the sensing devices close to the surface, more closely exposed to the environment in which sensing is to occur. The structure also allows for the placement of sensing films on nearer to the sensing devices and/or an oxide layer overlying the sensing devices.

SOI on package hypersensitive sensor

A method and apparatus are provided for protecting elements of a receiver from overvoltages in a pseudo-differential signal having a true signal and a reference voltage. The method and apparatus limit the true signal to a protection voltage, which is correlated to the reference voltage, to produce a protected true signal. The protected true signal and the reference voltage are applied to inputs of the receiver.

Use of a known common-mode voltage for input overvoltage protection in pseudo-differential receivers

A method and apparatus are provided for summing DC voltages, which employ at least one native transistor device to add a first DC input voltage to a second DC input voltage to produce a sum output.

Method and apparatus for summing DC voltages

A process for forming a capacitive structure that includes an upper layer having a first capacitor electrode section therein. A capacitor dielectric layer is formed adjacent the upper layer. The capacitor dielectric layer covers the first capacitor electrode section. A second capacitor electrode layer is formed adjacent the capacitor dielectric layer. The second capacitor electrode layer includes a second capacitor electrode section that at least partially covers the first capacitor electrode section, and which has an edge portion that extends beyond the underlying first capacitor electrode section. The capacitor dielectric layer being disposed between the first capacitor electrode section and the second capacitor electrode section. An upper dielectric layer is formed adjacent the second capacitor electrode section. Portions of the upper dielectric layer and the second capacitor electrode section are selectively removed to form a first via cavity that extends through the upper dielectric layer and the edge portion of the second capacitor electrode section. This exposes the edge portion of the second capacitor electrode section within the first via cavity. The first via cavity is filled with a via metal, which makes electrical connection with the edge portion of the second capacitor electrode section that is exposed within the first via cavity.

Analog capacitor in dual damascene process

An apparatus comprising a first plurality of parallel switches and a second plurality of parallel switches. The first plurality of parallel switches may be configured to control a voltage on a first output pin. The second plurality of parallel switches may be configured to control a voltage on a second output pin. The first and second pluralities of parallel switches may be configured to provide rise time control of a differential waveform and be driven by a phased data signal.

Programmable transmit SCSI equalization

A core voltage to input output voltage level shifter of the type that uses a reference voltage source to generate a reference voltage to limit a drain voltage on at least one voltage sensitive node connected to a voltage sensitive switching device, that resides on a high voltage domain. A feed back line runs from the voltage sensitive node to the reference voltage source. A feed back structure varies the reference voltage in response to the drain voltage on the at least one voltage sensitive node, and thereby maintains the drain voltage at a substantially constant desired value.

Level shifter reference generator

As technology in the semiconductor industry advances, semiconductor devices decrease in size to become faster and less expensive per function. Smaller semiconductor devices, particularly MOSFETs, are increasingly sensitive to Electrostatic Discharge (ESD). ESD can either destroy or permanently damage a semiconductor device. Embodiments of the present invention assist in preventing ESD damage to semiconductor devices. An embodiment of the present invention utilizes a diode connected to the substrate terminal of a MOSFET. Under normal operation up to the maximum operating voltage, the diode and MOS devices are open and do not conduct. The diode triggers when an ESD pulse causes the reverse breakdown voltage of the diode to be exceeded. The resultant current switches a connected MOS device, operating in bipolar mode, to dissipate the damaging ESD pulse. The ESD pulse is shunted to ground, thereby avoiding damage to the rest of the device.

Low voltage breakdown element for ESD trigger device

Growing community of inventors

Colorado Springs, CO, United States of America

Todd A Randazzo