Intel Corporation

Tod A Byquist

Michael T Crocker

Ben M Broili

Daniel P Carter

Michael S Brazel

David J Llapitan

Robert R Atkinson

Patrick S Johnson

Joseph A Cervantes

Peter Wesley Bristol

Russell S Aoki

Eric Dwight McAfee

Nicolas A Kurczewski

Shankar Krishnan

Stephen J Allen

Barry T Dale

Konomi Shimada

Mike S Brazel

Kristin L Weihl

Stella Latscha

Alexander D Williams

Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.

Integrated crossflow blower motor apparatus and system

Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.

Recirculating dielectric fluid cooling

In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.

Hinge assembly

A computing device including fastening features. The computing device may include an upper shell comprising an upper boss protruding from the upper shell, the upper boss defining a cavity. The computing device may include a lower shell comprising a lower boss protruding from the lower shell. The computing device may include a threaded insert including an insert portion received at the cavity of the upper boss. The threaded insert may include a flange portion wider than the insert portion, and a lateral movement reduction feature. The computing device may include a fastener received through the lower boss and through the threaded insert to fasten the upper shell and lower shell to each other.

Fastening techniques for electronic devices

A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.

Cast grid array (CGA) package and socket

According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.

Method and system of advanced fan speed control

In one embodiment, the present invention includes a load frame to be affixed to a primary surface of a circuit board adjacent to a socket, a load plate having a proximal portion rotatably adapted to the load frame and a distal portion having a tongue member to be locked by a shoulder member adapted to the circuit board on a side of the socket opposite to the frame, and a load lever to mate the load plate to the load frame, where the load lever is rotatable from an open position to an engaged position to lock the tongue member of the load plate under a head of the shoulder member. Other embodiments are described and claimed.

Intermediate load mechanism for a semiconductor package

According to some embodiments, at least one spring element is provided for a load compensator along with a restraining portion that maintains a pre-load compression for the spring element. Moreover, at least one surface may be provided to transfer force associated with an integrated circuit and a set of electrical contacts.

Load compensator with pre-load compression

An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

Electronic assemblies with high capacity heat sinks and methods of manufacture

In some embodiments, a system includes a socket having a first set of socket contacts exposed on a first side of the socket and a second set of socket contacts exposed on a second side of the socket; and a frame comprising at least one surface to engage two lower surfaces of the second side of the socket. The two lower surfaces may be coupled by a lower corner surface of the second side of the socket, and wherein the lower corner surface does not engage the frame.

Integrated circuit socket corner relief

A method and an apparatus for removably retaining an IC in engagement with a socket such that contacts carried by the package of the IC are pressed into engagement with contacts carried by the socket by way of a retention frame with ledges positioned opposite corresponding ledges of the socket and both a load plate and load lever pivotally connected to the retention frame.

Growing community of inventors

Federal Way, WA, United States of America

Tod A Byquist