Texas Instruments Corporation

Toby R Linder

John Charles Ehmke

Lance W Barron

Virgil Cotoco Ararao

A hermetic package comprising a substrate () having a surface with a MEMS structure () of a first height (), the substrate hermetically sealed to a cap () forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack () of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (); the stack having a bottom metal seed film () adhering to the substrate with a first width (), and further a top metal seed film () adhering to the cap with a second width () smaller than the first width, the top metal seed film tied to a layer () including gold-indium intermetallic compounds, layer () having a height greater than the first height.

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Dallas, TX, United States of America

Toby R Linder