Applied Materials, Inc.

Applied Materials Gmbh & Co Kg

Tobias Stolley

Stefan Bangert

Stefan Hein

Neil Morrison

Florian Ries

Jose Manuel Dieguez-Campo

Wolfgang Buschbeck

Hans-Georg Lotz

Andreas Lopp

Heike Landgraf

Markus Hanika

Ralph Lindenberg

Frank Fuchs

Uwe Schüssler

Volker Hacker

Uwe Hermanns

Uwe Schuessler

Michael Konig

Morrison Neil

Stefan Lorenz

Karl-Albert Keim

Harald Rost

Jurgen Schroeder

Manuel Jose Dieguez-Campo

An apparatus for processing a flexible substrate is provided including a vacuum chamber having a first chamber portion, second chamber portion and third chamber portion. The apparatus further includes an unwinding shaft supporting the flexible substrate to be processed and a winding shaft supporting the flexible substrate after processing, wherein the unwinding shaft and the winding shaft are disposed in the first chamber portion, a first wall separating the first chamber portion from the second chamber portion, wherein the first wall is inclined with respect to a vertical and horizontal orientation, a coating drum having a first portion disposed in the second chamber portion and a second portion disposed in the third chamber portion, and a plurality of processing stations disposed at least partially in the third chamber portion, wherein a majority of the plurality of the processing stations are disposed below a rotational axis of the coating drum.

Deposition platform for flexible substrates and method of operation thereof

According to the present disclosure, a substrate processing apparatus for processing a flexible substrate including a vacuum chamber configured for being evacuated and being configured for having a process gas provided therein, a processing module adapted to process the flexible substrate, wherein the processing module is provided within the vacuum chamber, and a discharging assembly configured to generate a flow of charged particles to discharge the flexible substrate is provided. The discharging assembly is configured to generate an electric field for ionizing a processing gas.

System and methods for processing a substrate

An apparatus includes a substrate support having an outer surface for guiding the substrate through a first vacuum processing region and at least one second vacuum processing region. First and second deposition sources correspond to the first processing region and at least one second deposition source corresponds to the at least one second vacuum processing region, wherein at least the first deposition source includes an electrode having a surface that opposes the substrate support. A processing gas inlet and a processing gas outlet are arranged at opposing sides of the surface of the electrode. At least one separation gas inlet how one or more openings, wherein the one or more openings are at least provided at one of opposing sides of the electrode surface such that the processing gas inlet and/or the processing gas outlet are provided between the one or more openings and the surface of the electrode.

Common deposition platform, processing station, and method of operation thereof

According to the present disclosure, a method for cleaning the processing chamber of a flexible substrate processing apparatus without breaking the vacuum in the processing chamber is provided. The method for cleaning the processing chamber includes guiding a sacrificial foil into the processing chamber; initiating a first pump process in the processing chamber; plasma cleaning the processing chamber while the sacrificial foil is provided in the processing chamber; initiating a second pump process in the processing chamber; and guiding a flexible substrate into the processing chamber.

Cleaning method for thin-film processing applications and apparatus for use therein

This invention relates to a coater for the coating, in particular, of large-area substrates by means of cathode sputtering, the coater having a coating chamber and, provided therein, a cathode assembly () where the material to be sputtered is located on a target () with a curved surface, the material to be sputtered being located, in particular, on the lateral surface of a cylinder, there being in a single coating chamber for a coherent coating zone at least three, preferably more, cathode assemblies () with rotatable, curved targets () positioned one beside the other.

Coater with a large-area assembly of rotatable magnetrons

This invention relates to an apparatus () for treating, e.g. coating, a substrate () in a vacuum chamber (). In this vacuum chamber () there are arranged n cathodes (-) and n+1 anodes (-), each of said anodes adjacent to a cathode (-). Each of the n cathodes (-) and n of the assigned anodes (-) are connected to a power supply (-). One of the anodes () not being assigned to a cathode (-) is connected to an electrical line () which is connecting each of the anodes (-). A pull-down resistor () is connected to said line () at its one end and to ground () at its other end.

Apparatus for treating a substrate

An arrangement for transporting a flat substrate through a coating installation, wherein the coating installation comprises, e.g., several and different sputter cathodes, to which the flat substrate, for example a glass pane, is transported one after the other in vacuo. So that no abrasion is generated between glass pane and contact, the glass pane is kept spaced apart from the contact by means of gas pressure. The gas pressure is herein built up through relatively few and small holes in a gas channel. Since during flooding of the coating installation to atmospheric pressure or during evacuation, due to the small holes, no fast pressure equalization between gas channel and the remaining coating installation is possible, the gas channel is decoupled in terms of gas from the remaining coating installation and provided with a separate gas line, via which gas can be introduced into the gas channel or pumped out of it.

Arrangement for transporting a flat substrate in a vacuum chamber

The invention relates to a method for operating a magnetron sputter cathode, in particular a tube cathode or several tube cathodes forming an array. In such cathodes a target passes through a magnetic field, whereby induction currents flow in the target which distort the magnetic field. This results in the nonuniform coating of a substrate. By having the relative movement between magnetic field and target alternately reverse its direction, the effect of the magnetic field distortion can be compensated. This yields greater uniformity of the coating on a substrate to be coated.

Method for operating a sputter cathode with a target

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Oberursel, Germany

Tobias Stolley