Ams Sensors Singapore Pte. Ltd.

Heptagon Micro Optics Pte. Ltd.

Tobias Senn

Hartmut Rudmann

Qichuan Yu

Markus Rossi

Moshe Doron

Bojan Tesanovic

Ohad Meitav

Han Nee Ng

Jens Geiger

Alexander Bietsch

Kai Engelhardt

Peter Roentgen

Mario Cesana

Bassam Hallal

Florin Cutu

Alireza Yasan

John A Vidallon

Devanraj Kupusamy

Ramon Opeda, Jr

Attilio Ferrari

Martin Schubert

Ji Wang

Jukka Alasirnio

Nicola Spring

Susanne Westenhöfer

Kam Wah Leong

James Eilertsen

Robert Lenart

Julien Boucart

Guo Xiong Wu

Cris Calsena

Harmut Rudmann

Jukka ALASIRNIÖX

An optoelectronic module includes a spacer with an optical component mounting surface, a fluid permeable channel, and a module mounting surface. The fluid permeable channel and module mounting surface allow the channels to be sealed to foreign matter during certain manufacturing steps and to remain free from blockages, such as solidified flux, during certain manufacturing steps. Further, the channels can permit heat to escape from the optoelectronic module during operation.

Optoelectronic modules having fluid permeable channels and methods for manufacturing the same

Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

Image sensor modules including primary high-resolution imagers and secondary imagers

The method regards manufacturing devices by replication, wherein each of the devices comprises a device surface. The method comprises producing the devices from a replication material by replication using a replication tool (), wherein the replication tool () comprises a tool material comprising replication sites () comprising a replication surface () each. Each of the replication surfaces () corresponds to a negative of the device surface of a respective one of the devices. The tool material comprises, in addition to the replication sites, one or more mitigating features () for reducing asymmetric form errors of the device surfaces. Replication tools () and methods for manufacturing these are also described.

Replication and related methods and devices, in particular for minimizing asymmetric form errors

The method for manufacturing a multitude of devices comprises: And it further comprises, after the conditioning: The treatment can comprise dimensionally changing the tool material by the exposure of the tool material to the conditioning material. Before carrying out the replication processes, the conditioning material can be hardened and removed.

Method for conditioning a replication tool and related method for manufacturing a multitude of devices

Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub&#xac;structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure. The optical element stack assembly further includes a spacer laterally surrounding, and moulded to, the first and second sub-assemblies.

Optical element stack assemblies

Optical assemblies include a stack of optical elements each of which has one or more alignment features. Each alignment feature traces a respective curve along a surface of one of the optical elements. The alignment feature(s) of one optical element fit within the alignment feature(s) of the other. In some cases, the alignment features can help establish more precise lateral alignment of the optical elements.

Optical assembly including passive optical elements having alignment features

The present disclosure describes optoelectronic modules (e.g., hybrid lens array packages) that have multiple optical channels, each of which includes at least one beam shaping element (e.g., a lens) that is part of a laterally contiguous array. Each optical channel is associated with a respective light sensitive region of an image sensor. Some or all of the channels also can include at least one beam shaping element (e.g., a lens) that is not part of a laterally contiguous array. In some cases, the arrays can include alignment features to facilitate alignment of the arrays with one another.

Optoelectronic modules including hybrid arrangements of beam shaping elements, and imaging devices incorporating the same

The present disclosure describes methods of attaching surfaces together. In one aspect, a method includes depositing a first adhesive onto a first surface of a first item, the first adhesive forming a pattern that at least partially surrounds a region of the first surface where there is no first adhesive. A second adhesive is jetted onto the region of the first surface, wherein the second adhesive has a viscosity lower than a viscosity of the first adhesive. The first surface of the first item and a second surface of a second item are brought into contact with one another. The method also includes curing the first and second adhesives. While the methods can be particularly suitable for manufacturing optical light guide elements, the methods also can be used in other contexts and applications as well.

Methods of attaching surfaces together by adhesives, and devices including surfaces attached together by adhesives

Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.

Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules

Optoelectronic modules for light emitting and/or light sensing include optical assemblies and active optoelectronic components. An optical assembly and a corresponding optoelectronic component can be aligned. The optoelectronic modules can include multiple optical assemblies and active optoelectronic components. Multiple optical assemblies and corresponding active optoelectronic components can be aligned independently of each other in various implementations of optoelectronic modules that include alignment features and optical assembly barrels.

Optoelectronic modules with optics integrated into a cap

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Zurich, Switzerland

Tobias Senn