Qorvo Us, Inc.

Tobias Mangold

Andreas Link

Loizos Loizou

The present disclosure relates to a module package with a shielded module and a process for making the same. The disclosed shielded module includes a module board, at least one flip-chip die attached to the module board, a mold compound with at least one via hole, and a shielding structure. The mold compound resides over the module board to partially encapsulate the at least one flip-chip die, where the at least one via hole extends vertically from a top surface of the mold compound to a top surface of the at least one flip-chip die. The shielding structure completely covers surfaces within the at least one via hole and extends over the top surface and side surfaces of the mold compound. Herein, the shielding structure is conductive and in contact with the top surface of the at least one flip-chip die.

Heat sinking by thru-mold vias in shielded modules

A module includes a protective shield with a three-dimensional (3D) pattern to increase a rate of heat dissipation. As circuit components get smaller in size, more circuit components can fit into a module, thereby increasing heat density in the module. Some of the heat in a module is conducted through an overmold disposed on the circuit components. The heat conducted through the overmold then dissipates through an optional protective shield on an exterior surface of the overmold. A rate of heat dissipation depends on the surface area of the overmold and, if any, the protective shield. In an exemplary aspect, a 3D pattern is formed in the exterior surface of the overmold to increase the surface area to increase a rate of heat dissipation from the module. Improved heat dissipation improves performance and product life of the circuit components in the module.

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Huglfing, Germany

Tobias Mangold