Epcos Ag

Tobias Krems

Ravi Kiran Challa

Peter Selmeier

Wolfgang Till

A reactance filter comprising suppression in the stop band comprises an input connection for applying an input signal, an output connection for outputting an output signal, at least series resonator, which is connected in a signal path between the input connection and the output connection, a parallel resonator, which is connected between the signal path and a connection in order to apply a reference potential, and an inductor, which is connected in series to the parallel resonator. A capacitor is connected by means of one connection between the at least one parallel resonator and the inductor and by means of the additional connection to the output connection. By connecting the reactance filter as a transmission filter in a duplexer component, the isolation in the receiving band of the duplexer component can be improved.

Reactance filter comprising suppression in the stop band and duplexer component

A surface acoustic wave filter includes an arrangement of transducers having at least one first transducer one second transducer and one third transducer. The at least one first transducer is connected to the input terminal and a terminal for applying a reference potential. The second transducer is connected to the first output terminal and the terminal for applying the reference potential. The third transducer is connected to the second output terminal and the terminal for applying the reference potential. A capacitor is connected to at least one of a first and second output terminal in such a way that the capacitor is connected between the first and second output terminals or between one of the first and second output terminals and the terminal for applying the reference potential.

Surface acoustic wave filter and duplexer component

An electrical component includes a substrate, component structures on the substrate, and solder metal platings electrically connected to the component structures. The substrate is electrically and mechanically connected in a flip chip arrangement to a carrier via connections formed by solder bumps. The solder bumps mate to the solder metal platings. At least one of the solder bumps is on a first solder metal plating. The first solder metal plating has first and second dimensions, where the first dimension is larger than the second dimension.

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Munich, Germany

Tobias Krems