Atotech Deutschland Gmbh

Tobias Bussenius

Ralph Rauenbusch

Ray Weinhold

Daniel Buchberger

Arnulf Fendel

Stefan Vitzthum

The present invention refers to a method for processing a wafer like substrate using a touching gripper and a touchless gripper. Furthermore, the present invention refers to an apparatus for processing a wafer-like substrate containing a touching gripper and a touchless gripper. Additionally, the present invention refers to the use of an inventive apparatus to process a wafer-like substrate.

Wafer-like substrate processing method and apparatus

A substrate holder for vertical galvanic metal deposition on a substrate, comprising a first substrate holder part and a second substrate holder part, wherein both said parts comprise an inner metal comprising part and an outer non-metallic part in which the substrate holder further comprises a hanging element in each substrate holder part, a first sealing element in each substrate holder part, a second sealing element between the inner metal comprising part and the outer non-metallic part of the substrate holder, a fastening system for detachably fastening both substrate holder parts to each other, a first contact element in each substrate holder part for forwarding current from an outer source through the hanging element to the at least second contact element, and a second contact element in each substrate holder part for forwarding current from the at least first contact element to the substrate to be treated.

Substrate holder for vertical galvanic metal deposition

This invention concerns a substrate holder reception apparatus () for clamping a substrate holder () in a substrate holder clamping direction (SHCD) in a predetermined position of the substrate holder () and releasing the substrate holder (), comprising at least one substrate holder connection device () for mechanical aligning and electrically contacting of the substrate holder (), wherein the substrate holder connection device () comprises a separate substrate holder alignment device () for aligning the substrate holder () with the substrate holder connection device () in an alignment direction, and a separate substrate holder contact device () for electrically contacting the substrate holder (). Further, the invention concerns an electrochemical treatment apparatus () comprising the substrate holder reception apparatus ().

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Berlin, Germany

Tobias Bussenius