Taiwan Semiconductor Manufacturing Comp. Ltd.

To-Yu Chen

Chiun-Chieh Su

Yung-Lung Hsu

Mei-Yen Li

Ming-Sung Kuo

Min-Sung Kuo

Chih-Shun Chu

An electromagnetic inspection tool which includes a stage configured to support a wafer having a first surface and an emitter configured to emit electromagnetic waves to be incident on the first surface. The electromagnetic inspection tool further includes a detector configured to detect electromagnetic waves returned from the first surface and a charging mechanism configured to charge the first surface. A method of electromagnetically inspecting a wafer which includes loading a wafer having a first surface onto a stage and emitting electromagnetic waves to be incident on the first surface. The method further includes detecting electromagnetic waves returned from the first surface and charging the first surface prior to detecting the electromagnetic waves returned from the first surface.

Wafer charging electromagnetic inspection tool and method of using

A method includes inspecting a wafer to find a first potential defect having a first wafer coordinate, and capturing a patch image of the first potential defect from the wafer. The patch image is compared with patterns of a wafer representation to find a first layout coordinate of a location in the wafer representation, wherein the location in the wafer representation corresponds to a location of the first potential defect in the wafer. A reference feature in the wafer representation is selected, wherein the reference feature in the wafer representation has a second layout coordinate. A coordinate difference between the first layout coordinate and the second layout coordinate is calculated. The coordinate difference is subtracted from the first wafer coordinate to calculate a second wafer coordinate of a reference feature in the wafer, wherein the reference feature in the wafer representation corresponds to the reference feature in the wafer.

Defect determination in integrated circuit manufacturing process

A method for detecting photoresist residue during semiconductor device manufacture includes developing photoresist on a surface of a semiconductor device to expose portions of the surface A plurality of etch paths are then partially etched into the surface and inspected to determine their depths.

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Tu-Ku Town, Taiwan

To-Yu Chen