Apple Inc.

To C Tan

Kuo-Hua Sung

Yingkan Lin

Cheuk Chi Lo

Patrick B Bennett

Chun-Ming Tang

Christopher L Boitnott

Cyrus Y Liu

Hui Chen

Alejandro X Levander

Koohee Han

Peng Xu

Display panels and methods of fabrication are described which a seal ring is formed within a build-up structure over a semiconductor substrate. The seal ring may include an outer perimeter wall and an inner setback wall spaced apart from the outer perimeter wall and directly underneath a contact ledge of the display panel.

Seal ring with inner setback wall for yield improvement

Components may have substrates with metal traces that form mating contacts. The components may be bonded together using anisotropic conductive adhesive bonding techniques. During bonding, conductive particles may be concentrated over the contacts by application of magnetic or electric fields or by using a template transfer process. Gaps between the contacts may be at least partially free of conductive particles to help isolate adjacent contacts. Polymer between the substrates may attach the substrates together. The conductive particles may be embedded in the polymer and crushed or melted to short opposing contacts together.

System with field-assisted conductive adhesive bonds

Growing community of inventors

Redwood City, CA, United States of America

To C Tan