Robert Boschgmbh

Kardion Gmbh

Tjalf Pirk

Stefan Pinter

Christoph Friese

Joerg Muchow

Andreas Krauss

Christoph Schelling

Heribert Weber

Hubert Benzel

Ando Feyh

Axel Franke

Franz Laermer

Frank Fischer

Frieder Haag

Ricardo Ehrenpfordt

Joachim Fritz

Michael Stumber

Stefan Finkbeiner

Thomas Buck

Stefan Leidich

Thomas Alexander Schlebusch

Stefano Delfini

Heiko Stahl

Frederic Njikam Njimonzie

Arnim Hoechst

Ralf Reichenbach

Ingo Herrmann

Friedjof Heuck

Gilbert Moersch

Frederik Ante

Laura Bohne

Thomas Wagner

Georg Bischopink

Dick Scholten

Janpeter Wolff

Ralf Moos

Inga Schellenberg

Hardy Baumbach

Matthias Fuertsch

Joachim Rudhard

Robert Sattler

Petra Stedile

Christine Engel

Michael Krueger

Gerd Scheying

Sonja Knies

Karl-Franz Reinhart

Juergen Butz

Helmut Schmidt

Veronique Krueger

Martina Budde

Johannes Kenntner

Michael Butzin

Marco Lammer

Suresh Palale

Joachim Loeblein

Wolfgang Pleuger

Hermann Sandmaier

Martin Bogner

Pardhasaradhi Vemulamada

Joachim Saegebarth

Mehran Ghahremanpour

Oliver Schecker

Thomas Teuschel

Dominik Hanft

Tobias Zoller

Jin Han Jeon

Yong Heng So

Olivier Schecker

Helene Ritter

The invention relates to a device () for monitoring the state of health of a patient (), wherein the device () comprises an input interface () for inputting a first pressure signal () and a second pressure signal () and a processing unit () for processing the first pressure signal () and the second pressure signal () in order to determine a processing value () in order to monitor the state of health of the patient () based the processing value ().

Device and method for monitoring the state of health of a patient

A measuring device for a fastening device includes a base body, a sensor unit configured to detect at least one fastening variable, and an interface connected to the sensor unit and configured to provide the detected at least one fastening variable to an external reading device. The interface is electrically connectable to a wireless communication unit or directly connectable to the external reading device.

Anchoring device

A method for producing an electrical device including an electrical component at least partially covered by a covering material having a cement material includes supplying the cement material, mixing an additive into the cement material, applying the covering material having the cement material with the additive onto the electrical component, and treating the covering material. The treatment allows the additive from the cement material to reach a surface of the cement material and to form a protective layer on the surface.

Method for producing an electrical device comprising a covering material

A method for producing a galvanic element includes applying a first electrode to a substrate, applying a separator to the first electrode, and applying a second electrode to the separator. At least one of the electrodes is applied in the form of a composite electrode using an aerosol separation method.

Method for producing a galvanic element and galvanic element

An arrangement of at least two wafers for detecting electromagnetic radiation, in particular far infrared radiation, comprises a first wafer and a second wafer. The first wafer includes a microsystem formed as a sensor array. The microsystem is configured to register electromagnetic radiation and provide a corresponding sensor signal. The second wafer includes an integrated circuit formed as an evaluation circuit that is coupled to the sensor array. The integrated circuit is configured to detect the electromagnetic radiation with the aid of the sensor signal provided.

Device having at least two wafers for detecting electromagnetic radiation and method for producing said device

A method for producing a multi-layer electrode system includes providing a carrier substrate having a recess in a top side of the carrier substrate. At least one wall of the recess is inclined in relation to a bottom side of the carrier substrate, which is opposite to the top side. The method also includes applying a multi-layer stack, which includes at least a first electrode layer, a second electrode layer, and a piezoelectric layer arranged between the first electrode layer and the second electrode layer, to the top side of the carrier substrate. At least the wall and a bottom of the recess are covered by at least a portion of the multi-layer stack.

Method for producing a multi-layer electrode system

A method for production of a thin-film battery includes providing a mount structure, applying of a first unmasked flow of a first electrode material to the mount structure in order to form a first electrode layer, applying a second unmasked flow of a battery material in order to form a battery layer, and applying a third unmasked flow of a second electrode material in order to form a second electrode layer. The applying steps are repeated in order to produce a thin-film battery which consists of a plurality of first electrode layers, a plurality of battery layers, and a plurality of second electrode layers.

Method and apparatus for production of a thin-film battery

A microelectromechanical sensor module includes a sensing mechanism for measuring an acceleration, pressure, air humidity or the like, a control mechanism for controlling the sensing mechanism, an energy supply mechanism for supplying the sensor module with energy, and a transmission mechanism for transmitting signals of the sensing mechanism. At least three of the mechanisms are integrated at the chip level in at least one chip in each case. A corresponding method is implemented to produce the microelectromechanical sensor module.

Microelectromechanical sensor module and corresponding production method

A semiconductor substrate-based system for an RFID device, in particular an RFID transponder, having a semiconductor substrate and an electronic circuit system which is structured on the semiconductor substrate is provided. The semiconductor substrate-based system also has a thin-layer battery, likewise structured on the semiconductor substrate, for supplying power to the RFID device. Moreover, an RFID device having a corresponding semiconductor substrate-based system, and a method for manufacturing a corresponding semiconductor substrate-based system are provided.

Semiconductor substrate-based system for an RFID device, RFID device, and method for manufacturing such a semiconductor substrate-based system

A layer system includes at least three layers, the three layers including a top electrode layer, a bottom electrode layer, and an electrolyte layer situated between the top electrode layer and the bottom electrode layer. The electrolyte layer has a solid-state electrolyte, and at least one of the top and bottom electrode layers includes a paste-like composite layer. A layer system of this type may be used to manufacture in particular energy stores, such as rechargeable lithium-ion accumulators, having an enhanced capacity. Moreover, a method for producing a layer system or an energy store is described.

Layer system, energy store, and method for manufacturing an energy store

A configuration includes at least three successive layers, the three layers having a top electrode layer, a bottom electrode layer, and an electrolyte layer situated between the top electrode layer and the bottom electrode layer. At least the electrolyte layer and one of the top electrode layer or the bottom electrode layer have an organic matrix, and the organic matrix of the electrolyte layer has an ionic conductivity in a range of &#x2267;10S/cm. Such a configuration is suitable in particular for forming a rechargeable lithium-ion battery and permits simple and cost-effective manufacturing and good adaptability to the desired application.

Layer configuration

A cascaded micromechanical actuator structure for rotating a micromechanical component about a rotation axis is described. The structure includes a torsion spring device which, on the one hand, is attached to a mount and to which, on the other hand, the micromechanical component is attachable. The torsion spring device has a plurality of torsion springs which run along or parallel to the rotation axis. The structure includes a rotary drive device having a plurality of rotary drives which are connected to the torsion spring device in such a way that each rotary drive contributes a fraction to an overall rotation angle of a micromechanical component about the rotation axis.

Cascaded micromechanical actuator structure

A method for constructing an electrical circuit that includes at least one semiconductor chip encapsulated with a potting compound is disclosed. The method includes applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit including the at least one semiconductor chip.

Method for constructing an electrical circuit, and electrical circuit

In a micromechanical component having an inclined structure and a corresponding manufacturing method, the component includes a substrate having a surface; a first anchor, which is provided on the surface of the substrate and which extends away from the substrate; and at least one cantilever, which is provided on a lateral surface of the anchor, and which points at an inclination away from the anchor.

Micromechanical component having an inclined structure and corresponding manufacturing method

A micromechanical actuator includes a shaft and at least a first driving mechanism. The shaft and the first driving mechanism are connected by a first joint.

Micromechanical actuator having multiple joints

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Stuttgart, Germany

Tjalf Pirk