The Charles Stark Draper Laboratory, Inc.

Infrared Newco, Inc.

Axsun Technologies, Inc.

Tirunelveli Subramaniam Sriram

Bryan McLaughlin

Brian R Smith

John Lachapelle

Conor S Rafferty

Clifford Alan King

Bryan D Ackland

Anders Ingvar Aberg

David J Carter

Eugene H Cook

James Zambuto

William Whitcomb McFarland

John Joseph LeBlanc

Alla A Gimbel

Parshant Kumar

John R Burns, Iv

Clayton Morris

David A Coppeta

Julianne Grainger

John Burns Iv

Brian Smith

The present disclosure discusses a method of manufacturing an implantable neural electrode. The method includes cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces connecting the electrode sites to the contact pads. A first silicone layer including a mesh is formed and coupled to the metal layer. A second silicone layer is formed and laminated to the first silicone layer coupled with the metal layer. Holes are formed in the first or second silicone layer exposing the contact pads and electrode sites. Wires are welded to the exposed contact pads and a third layer of silicone is overmolded over the contact pads and wires.

Method of manufacturing an implantable neural electrode interface platform

A mold for casting a micro-scale structure includes an upper surface including a first cavity having a first depth. A negative pattern for an array of micro-scale structures is defined in a surface of the first cavity. The mold includes at least one second cavity having a second depth defined in the cavity outside of the negative pattern for the array of micro-scale structures. The at least one second cavity defines a negative pattern for a standoff of the micro-scale structure. A fabric retaining frame is disposed in the first cavity.

Polymer microwedges and methods of manufacturing same

A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.

Method for bonding a hermetic module to an electrode array

Systems and methods for modulating a physiological process are provided to enable precise delivery of signals to a predetermined treatment site. The systems may comprise an implantable device and an electrical lead body. The electrical lead body may comprise a plurality of transducer contacts in close proximity to an end of the electrical lead body, and a control unit positioned within the lead body in close proximity to the plurality of transducer contacts.

Distributed neuro-modulation system with auxiliary stimulation-recording control units

Methods for bonding a hermetic module to an electrode array

An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact.

Bio-implantable hermetic integrated ultra high density device

Optical imaging structures and methods are disclosed. One structure may be implemented as an imaging pixel having multiple photodetectors. The photodetectors may detect different wavelengths of incident radiation, and may be operated simultaneously or at separate times. An imager may include an imaging array of pixels of the type described. Methods of operating such structures are also described.

Imaging apparatus and methods

Imagers, pixels, and methods of using the same are disclosed for imaging in various spectra, such as visible, near infrared (IR), and short wavelength IR (SWIR). The imager may have an imaging array having pixels of different types. The different types of pixels may detect different ranges of wavelengths in the IR, or the SWIR, spectra. The pixels may include a filter which blocks some wavelengths of radiation in the IR spectrum while passing other wavelengths. The filter may be formed of a semiconductor material, and therefore may be easily integrated with a CMOS pixel using conventional CMOS processing techniques.

A probe of a Raman spectroscopy system has a wavelength and/or amplitude referencing system for determining a wavelength of the excitation signal. Preferably, this referencing system is near an output aperture, through which the excitation signal is transmitted to the sample. In this way, any birefringence or polarization dependent loss (PDL) that may be introduced by optical elements in the system can be compensated for since the wavelength reference system will detect the effect or impact of these elements.

Probe for tunable laser Raman spectroscopy system

Growing community of inventors

Acton, MA, United States of America

Tirunelveli Subramaniam Sriram