Rohm and Haas Company

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Rodel Holdings, Inc.

Agrofresh Inc.

Dow Global Technolgoies LLC

Nutrition & Biosciences USA 1, LLC

Tirthankar Ghosh

Barry Weinstein

Terence M Thomas

Hongyu Wang

Jinru Bian

Stephanie Nussbaum Cottrell

Edwin Hugh Nungesser

John William Ashmore

John R Mattox

Scott Alan Ibbitson

Fanwen Zeng

Morris C Wills

Freddie L Singleton

Kiran Pareek

Nilesh Shah

Joseph Martin Rokowski

Selvanathan Arumugam

Robert David Solomon

William M Hann

David W Potter

David Michael Laganella

Jennifer Reichl Collin

Wesley D Costas

Heather R Mcginley

Jose Pineda Lalas

Thomas D Rogerson

Karel-Anne Valentine

Kimberly S Cagle

Morris Christopher Wills

Randall Liang

Stephanie N Cottrell

Provided are systems and methods for solvent-free delivery of volatile compounds, where an energy source is used to release the volatile compounds. The systems and methods provided herein have at least one advantage of (1) no solvent (for example water) is required; (2) immediate release of volatile compounds (for example 1-MCP can be released from HAIP within milliseconds or seconds instead of minutes or hours of the existing method using water); and/or (3) instantly starting and stopping the delivery of the volatile compound.

Systems and methods for solvent-free delivery of volatile compounds

The present invention is based on the discovery of a stable water-in-oil-in-water double emulsion. The double emulsion composition disclosed may contain molecular complex of volatile compounds for example 1-methylcyclopropene (1-MCP). In addition, the double emulsion composition disclosed can provide prolong or controlled release of the volatile compounds.

Stable emulsion formulations of encapsulated volatile compounds

Provided are antimicrobial compositions comprising: ortho phenylphenol and silver. The compositions are useful for controlling microorganisms in aqueous or water-containing systems.

Antimicrobial composition of ortho phenylphenol and silver

A biocidal composition comprising 2,2-dibromomalonamide and a metal selected from silver, copper, and mixtures thereof, and its use for the control of microorganisms in aqueous and water-containing systems.

Compositions of dibromomalanomide and their use as biocides

A method for chemical mechanical polishing of a semiconductor wafer containing a nonferrous metal is provided, comprising: providing a chemical mechanical polishing composition comprising 1 to 25 wt % of an oxidizer; 0.01 to 15 wt % of an inhibitor for the nonferrous metal; 0.005 to 5 wt % of a copolymer of poly(ethylene glycol) methyl ether(meth)acrylate and 1-vinylimidazole; and water; wherein the chemical mechanical polishing composition has an acidic pH; providing a chemical mechanical polishing pad; providing a semiconductor wafer containing the nonferrous metal; creating dynamic contact between the chemical mechanical polishing pad and the semiconductor wafer; and, dispensing the polishing solution at or near the interface between the chemical mechanical polishing pad and the semiconductor wafer.

Chemical mechanical polishing composition and methods relating thereto

A chemical mechanical polishing composition useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The chemical mechanical polishing composition comprises an inhibitor for the nonferrous metal; a copolymer of poly(ethylene glycol)methyl ether (meth)acrylate and 1-vinylimidazole; and water.

There is provided a coating composition comprising

Microbiocidal coatings

A composition useful for treating fabrics. The composition contains a silver-containing copolymer having polymerized units of a monomer X and a monomer Y; wherein monomer X is an ethylenically unsaturated compound having a substituent group selected from an unsaturated or aromatic heterocyclic group having at least one nitrogen atom; wherein monomer Y is selected from carboxylic acids, carboxylic acid salts, carboxylic acid esters, organosulfuric acids, organosulfuric acid salts, sulfonic acids, sulfonic acid salts, phosphonic acids, phosphonic acid salts, vinyl esters, (meth)acrylamides, C-Caromatic monomers containing at least one exocyclic ethylenic unsaturation and combinations thereof.

Composition for polyester fabric treatment

A composition useful for treating fabrics. The composition contains a silver-containing copolymer having polymerized units of a monomer X which is an ethylenically unsaturated compound having a substituent group selected from an unsaturated or aromatic heterocyclic group having at least one nitrogen atom and polymerized units of a monomer Y which is an ethylenically unsaturated compound selected from carboxylic acids, organosulfuric acids, sulfonic acids, phosphonic acids and esters comprising polymerized units of ethylene oxide.

Method for fabric treatment at low pH

Fibers that durably contain antimicrobial materials such that the antimicrobial materials are resistant to being abraided away or washed off during use. The antimicrobial materials contained in the fibers are not prone to the development of resistant strains of bacteria. Also disclosed are methods of making and using the fibers.

Method of making a fiber containing an antimicrobial composition

A method for treating wood to inhibit leaching of copper compounds into the environment. The method comprises treating the wood with a copper-containing wood preservative and a latex copolymer.

Wood treatment method

A latex copolymer composition comprising &#x3e;5 wt % of polymerized units derived from a monomer X containing an unsaturated heterocycle, wherein the latex copolymer composition comprises &#x2266;1,000 ppm of residual monomer X is disclosed. Also disclosed are methods of making and using the latex copolymer compositions.

Heterocyclic latex copolymer and methods of making and using same

A method for preserving wood by contacting wood with a composition comprising an aqueous polymer dispersion, at least one surfactant, and a wood preservative.

Wood preservatives

An aqueous abrasive-free composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0 to 15 weight percent water soluble modified cellulose, 0 to 15 weight percent phosphorus compound, 0.005 to 5 weight percent of an amphiphilic polymer, the amphiphilic polymer having an ionic hydrophilic portion with a carbon number of 2 to 250 and water.

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Oreland, PA, United States of America

Tirthankar Ghosh