Industrial Technology Research Institute

Ting-Yu Wang

Hsuan-Yu Lin

Chih-Ming Lai

Yu-Lin Hsu

Yen-Ting Wu

Hung-Hsien Ko

Ting-Yu Ke

Wen-Hung Liu

Liang-Hsuan Tai

Hong-Yu Chen

The disclosure relates to a voice signal analysis method and device and a chip design method and device. The voice signal analysis method includes: in a first updating gradient, training a resolution recovery model by using first voice training data meeting a same grouping condition in multiple mission sets; in a second updating gradient, training the resolution recovery model by interleavingly using second voice training data meeting different grouping conditions in the mission sets; iteratively executing the first and second updating gradients to set an initial model parameter of the resolution recovery model; and recovering a high-resolution snore signal from a low-resolution snore signal by using the resolution recovery model. The low-resolution snore signal has a lower resolution than the high-resolution snore signal.

Voice signal analysis method and device and chip design method and device

A stretchable circuit is provided in the invention. The stretchable circuit comprises a plurality of segments. Each segment includes a plurality of sub-segments. Each sub-segment includes at least one main line, at least one secondary line, and rib lines, and in each sub-segment, the main lines and the secondary lines are electrically connected to the rib lines.

Stretchable circuit and layout method for stretchable circuit

A light emitting device including a substrate, a first electrode, a light emitting layer, a second electrode, a heat shrinkable film and a first adhesive layer is provided. The first electrode is disposed on the substrate. The light emitting layer is disposed on the first electrode. The second electrode is disposed on the light emitting layer. The first electrode, the light emitting layer, and the second electrode are sequentially stacked on the substrate to form a light emitting cell. The heat shrinkable film is disposed on the light emitting cell. The first adhesive layer is disposed between the heat shrinkable film and the second electrode.

Light emitting device

A light-emitting device and a method of manufacturing a light-emitting device are provided. The light-emitting device includes a transparent substrate having a first surface and a second surface opposite to the first surface, a light-emitting structure disposed on the first surface of the transparent substrate, a sealing layer, a carrier board, and a positive electrode and a negative electrode. The transparent substrate, the light-emitting structure, the sealing layer and the carrier board have corresponding through holes respectively, and at least one of the positive electrode and the negative electrode is disposed on the second surface of the transparent substrate.

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Kaohsiung, Taiwan

Ting-Yu Wang