Wiwynn Corporation

Ting-Yu Pai

Tsung-Han Li

Yi Cheng

Chin-Han Chan

Tai-Ying Tu

Chun-Wei Lin

Chia-Yi Wu

Chin-Hao Hsu

Li-Wei Chen

Pai-Chieh Huang

Shih-Lung Lin

Hsien-Chieh Hsieh

Tzu-Ting Wang

Kang-Bin Mah

Tsung-Lin Liu

Jun Da Chen

Zi Ping Wu

Yu-Cheng Chu

Yao-Sheng Huang

Wei-Ching Chang

Zi-Ping Wu

A piece of immersion liquid cooling equipment, which is adapted for an electronic device, includes a tank, a condenser, a cold plate, and a first pipe. The tank accommodates a first fluid, and the electronic device is immersed in the first fluid in the form of a liquid. The condenser is disposed in the tank and located above the first fluid in the form of a liquid. The cold plate is disposed in the tank and is in thermal contact with at least one high power commodity of the electronic device. The first pipe is disposed and extends between an exterior and an interior of the tank. The first pipe communicates with the condenser and the cold plate. The first pipe is configured to receive a second fluid to flow through the condenser and the cold plate. A heat dissipation method for an electronic device.

Immersion liquid cooling equipment and heat dissipation method for electronic device

The invention provides an immersion fluid module including a tank, a heat exchanger, a condenser, and at least one pipe. The tank contains a first fluid. An electronic device is disposed in the tank and is at least partially immersed in the first fluid in a liquid state. The heat exchanger is disposed in the tank and is at least partially immersed in the first fluid in the liquid state. The condenser is disposed in the tank. The pipe connects the heat exchanger and the condenser. A second fluid is provided to the pipe, and a temperature of the second fluid is higher than a preset value. When an ambient temperature of the electronic device is lower than the preset value, the second fluid flows through the heat exchanger to raise the ambient temperature of the electronic device. The invention also provides a server system.

Immersion fluid module and server system

An immersion cooling system includes a work tank, a chip device, a microchannel device, a first communication pipeline, and a first heat exchange device. The work tank includes a fluid section. The chip device is in the fluid section and has an inlet and an outlet. The chip device includes a motherboard, a chip, and a cover. The motherboard has a main surface substantially parallel to a vertical line. The cover is on the motherboard. The chip is between the cover and the motherboard. The microchannel device is in the chip device. Two ends of the microchannel device are respectively in communication with the inlet and the outlet. The first communication pipeline and the first heat exchange device are in the fluid section. Two ends of the first communication pipeline are respectively in communication with the outlet and the first heat exchange device.

Immersion cooling system

An immersion cooling system includes a box body, a condensing structure and a pressure adjusting module. The box body has a first containing space, the first containing space is adapted to contain a heat dissipation medium, and at least one heat generating component is disposed in the first containing space to be immersed in the heat dissipation medium which is in liquid state. The condensing structure is disposed in the first containing space and above the heat dissipation medium which is in liquid state. The pressure adjusting module is adapted to actively drive a fluid in the first containing space to flow into the second containing space, such that a pressure in the first containing space is reduced to be less than an external pressure. In addition, an electronic apparatus having the immersion cooling system and a pressure adjusting module are also provided.

Immersion cooling system and electronic apparatus having the same and pressure adjusting module

A flow dividing device including a box body and a baffle set is provided. The box body includes a chamber, an inflow port, and an outflow port. The baffle set is located in the chamber and divides the chamber into a plurality of guide channels, and two ends of the guide channel communicate with the inflow port and the outflow port respectively. After flowing into the flow dividing device, the condensate fluid can guide different liquids in the condensate fluid to separate from each other. An immersion cooling system including the flow dividing device and a fluid separation method of the immersion cooling system are also provided.

Flow dividing device and immersion cooling system having the same

A package assembly includes a substrate, an electronic component and a cover. The electronic component and the cover are disposed on the substrate, wherein the electronic component is located within a chamber between the cover and the substrate. A cooling liquid may be filled in a heat dissipation space of the cover, so as to dissipate the heat generated by the electronic component. Furthermore, the cooling liquid may be filled in the chamber where the electronic component is located, so as to directly dissipate the heat generated by the electronic component.

Package assembly

A separate immersion cooling system includes a separate immersion cooling device. The separate immersion cooling device includes a condensing device, a plurality of cooling tanks, a plurality of outflow pipes and a plurality of return pipes. The separate immersion cooling device is adapted to cooling a heat-generating device immersed in the cooling tank.

Separate immersion cooling device and separate immersion cooling system having the same

An electronic apparatus includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid amount adjusting module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank to be immersed in the heat dissipation medium. The liquid adjusting module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to be overflowed into the auxiliary tank. The pump is disposed in the auxiliary tank and adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.

Electronic apparatus, immersion cooling system and liquid amount adjusting module

An electronic apparatus including at least one heat generating component and an immersion cooling system is provided. The immersion cooling system includes a box body and a condensation module. The box body is adapted to accommodate a coolant, and the heat generating component is disposed in the box body to be immersed in the coolant in a liquid state. The condensation module includes a pipeline and a condensate, and the pipeline passes through the box body and is adapted for the condensate to flow. At least one parameter of the condensate may be changed to lower a boiling point of the coolant to a predetermined value by lowering the temperature in the box body with the condensate. In addition, an operating method of the electronic apparatus is also provided.

Electronic apparatus having immersion cooling system and operating method thereof

An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.

Immersion cooling system and electronic apparatus having the same

An electronic apparatus includes an airflow generation device and a passive component. The passive component is a temperature sensor and includes a component body and a heat sink attached to the component body. The heat sink can absorb environmental heat which is dissipated through the air flow. The airflow generation device operates according to a sensing result by the passive component.

Electronic apparatus with a temperature sensor

An electronic apparatus including a box body, at least one heat generating element and an immersion cooling module are provided. The immersion cooling module includes a condensing structure and an airflow guiding device. The box body has a containing space, and the containing space is adapted to contain a heat dissipation medium. The heat generating element is disposed in the containing space to be immersed in the heat dissipation medium which is in the liquid state. The condensing structure is disposed in the containing space and includes a first condensing portion. The airflow guiding device is disposed in the box body and is adapted to guide the heat dissipation medium which is in the gaseous state toward the first condensing portion.

Immersion cooling module and electronic apparatus having the same

An adjustable fixing device applied to a heat dissipating component is used in an electronic apparatus. The adjustable fixing device includes a first connecting component, a second connecting component and a fixing component. The first connecting component has a first stopper portion. The second connecting component has a first screwing portion and is detachably connected to the first connecting component. The fixing component includes a main body, a second stopper portion and a second screwing portion. The main body has a first part and a second part. The second stopper portion is disposed on the first part to move relative to the first stopper portion according to rotation of the main body. The second screwing portion is disposed on the second part and used to engage with the first screwing portion.

Growing community of inventors

Taipei, Taiwan

Ting-Yu Pai