Foci Fiber Optic Communications, Inc.

Ting-Yan Lin

Po-Yi Wu

Ting-Ta Hu

Chieh-Yu Fang

Chia-Kuo Chen

The present invention provides an optical interposer for chip connection including a first total internal reflective layer, a waveguide and a second total internal reflective layer. The optical interposer is disposed above a first photonic integrated circuit chip and a second photonic integrated circuit chip, coupling with the first photonic integrated circuit chip and the second photonic integrated circuit chip. The refractive indices of the first total internal reflective layer and the second total internal reflective layer are lower than the waveguide, making a light signal perform repetitive total internal reflections at the junctions between materials and advance in a zigzag shape within the waveguide, and further transmit between the first photonic integrated circuit chip and the second photonic integrated circuit chip.

Optical interposer for chip connection

The present invention provides a semiconductor structure including a substrate, a metal reflective layer, a UV glue layer, and an element. The metal reflective layer is placed on the surface of the substrate, and the UV glue layer is placed on the surface of the metal reflective layer. The element is manufactured by light-transparent material. The UV glue layer adheres the element to the metal reflective layer. By so, in the light-curing process, the curing of the UV glue is accelerated due to the metal reflective layer reflecting an ultraviolet ray.

Semiconductor structure

A pluggable optical packaging structure is provided, including: a substrate, a carrier ring, at least one optical connection assembly and a cover plate; the substrate includes at least one electronic integrated circuit (EIC) and at least one photonic integrated circuit (PIC); the carrier ring is located on the substrate, and the EIC and PIC are enclosed by the carrier ring; the optical connection assembly includes at least one socket, at least one connector, a plurality of optical fibers and at least one optical fiber array connector, the socket is located in a partial section of the carrier ring, the connector is in the socket, the optical fibers has one end coupled to the connector, the other end coupled to the fiber array connector, and is coupled to the PIC through the fiber array connector; the cover plate is located on the carrier ring and extends inwardly to above the PIC.

Growing community of inventors

HSINCHU, Taiwan

Ting-Yan Lin