Taiwan Semiconductor Manufacturing Comp. Ltd.

Ting-Wei Wang

Jen-Ti Wang

Kuo-Fong Chuang

Wei-Chih Chen

Shi-Chi Chen

Tzu-Chi Chiu

Wen-Chieh Tsou

Hsueh-Lei Wang

A method includes moving a wafer transport device to a position above a load port; lowering a hoist unit of the wafer transport device above the load port, wherein the wafer transport device has a plurality of belts, each of the belts is connected to the hoist unit and wound around a respective belt winding drum; detecting sound waves from the belts by using at least one acoustic sensor to measure tensions of the belts; and comparing the tensions from the belts to determine an inclination of the hoist unit.

Method for transporting wafers

A method includes disposing, by using a transport module of a workpiece storage system, a first workpiece on a first workpiece carrier; disposing, by using the transport module, the first workpiece carrier with the first workpiece in a workpiece container; disposing, by using the transport module, a second workpiece in the workpiece container, wherein the first workpiece and the second workpiece have different sizes; and transferring, by using the transport module, the workpiece container containing the second workpiece and the first workpiece carrier with the first workpiece to a stocker to store the workpiece container.

Method of storing workpiece using workpiece storage system

A method for storage a workpiece used in fabrication of a semiconductor device includes disposing the workpiece on a workpiece carrier, disposing the workpiece carrier with the workpiece in a workpiece container via a workpiece storage system, identifying a content of the workpiece container, and adjusting a storage condition inside the workpiece container in response to the content of the workpiece container via the workpiece storage system.

Workpiece storage system, method of storing workpiece, and method of transferring workpiece using the same

A wafer transport device is moved on a transport rail, and stopped above a load port having a top surface. A light beam is projected onto the top surface of the load port, and image of the top surface is and the light beam is captured. A position of the hoist unit of the wafer transport device is aligned with respect to a position of the load port according to the image. The hoist unit is lowered toward the load port.

Wafer transport system and method for transporting wafers

A cleaning module adapted for cleaning a load port of a processing apparatus in semiconductor fabrication is provided. The cleaning module includes a housing having at least one opening formed on a bottom wall panel of the housing. The cleaning module further includes a filter unit positioned in the housing. The leaning module also includes a driving assembly. The driving assembly is arranged to correspond to the opening and positioned in the housing. The driving assembly is used to create an air flow from outside of the housing via the opening to the filter unit. The filter unit is used to separate particles or contaminants from the air flow.

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Taichung, Taiwan

Ting-Wei Wang